Used SMT Equipment | In-Circuit Testers
Fujikura FSM-11S The SpliceMate (FSM11S) is the world s smallest and most portable fusion splicer, designed to meet the challenges posed by today s fiber networks. Fitting in the palm of your hand, the SpliceMate is smart and reliable enough to b
Used SMT Equipment | In-Circuit Testers
Fujikura FSM-11S The SpliceMate (FSM11S) is the world s smallest and most portable fusion splicer, designed to meet the challenges posed by today s fiber networks. Fitting in the palm of your hand, the SpliceMate is smart and reliable enough to b
Used SMT Equipment | In-Circuit Testers
Fujikura FSM-11S The SpliceMate (FSM11S) is the world s smallest and most portable fusion splicer, designed to meet the challenges posed by today s fiber networks. Fitting in the palm of your hand, the SpliceMate is smart and reliable enough to b
Transition to Lead free will impact almost everyone in the electronics industry whether you consider yourself RoHS exempt or not. This is not a theoretical course. The objective of this course is to show you how you can resolve the business and techn
Technical Library | 2022-01-12 19:26:19.0
Autonomous vehicles have the potential to revolutionize the automotive industry and are gaining immense attention from academia as well as industry. However, facets of autonomous vehicle systems related to the interconnection of independent components pose vulnerabilities to the system as a whole. These vulnerabilities aren't guaranteed to be solved by traditional security methods. Blockchain technology is a powerful tool that can aid in improving trust and reliability in such systems.
Technical Library | 2023-11-20 17:42:33.0
Zero-defect strategies and increased demands on the production of assemblies are making quality assurance in electronics production increasingly important. Continous miniaturization of components, ever higher packing densities and the associated hard-to-view assembly areas, as well as the increased use of components such as BGAs, QFNs and QFPs, pose a considerable challenge when it comes to high-precision quality control.
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
Career Center | Exton, Pennsylvania USA | Engineering,Maintenance
Innovative Solutions and Support is an industry leader in supplying analog and digital instrumentation to the military, commercial and business sectors within the aviation marketplace. We provide technological solutions to some of the most substantia
Career Center | Corona, California USA | Maintenance,Technical Support
Aqueous Technologies seeks a strategic individual to support its customer base and perform in-field equipment repairs. Product line includes defluxing and cleanliness testing systems utilized in the electronic manufacturing assembly industry. Positio
Technical Library | 2013-01-03 20:27:54.0
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not detected by electrical testing or non-destructive inspection methods, yet they pose a long term reliability risk since the cracks may propagate under subsequent loads to cause electrical failure. Since the initiation of pad cratering does not result in an instantaneous electrical signature, detecting the onset of this failure has been challenging. An acoustic emission methodology was recently developed by the authors to detect the onset of pad cratering. The instantaneous release of elastic energy associated with the initiation of an internal crack, i.e., Acoustic Emission (AE), can be monitored to accurately determine the onset of both pad cratering and brittle intermetallic (IMC) failures.
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