New Equipment | Test Equipment
Application of new and innovative design features to increase test speed, board access, reliability, and repeat-ability, have opened up new possibilities for deployment of Acculogic’s FLS900 series testers. As the first patented flying prober with do
Excessive torque can cause damage while insufficient torque can pose a safety risk. In machining and delicate assembly work, it is extremely important to be able to control the tightening torque for screws. PB Swiss Tools, a leading partner for qual
Technical Library | 2016-08-11 15:49:59.0
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliability requirements. Our test vehicles have micro-bumped die having pitches ranging from 60um down to 30um. The high density of pads and the large die size, make it extremely challenging to ensure that all of the micro-bump interconnects are attached to a thin Si-interposer. In addition, the low standoff between the die and interposer make it difficult to underfill. A likely approach is to first attach the die to the interposer and then the die/interposer sub-assembly to the substrate. In this scenario, the die/interposer sub-assembly is comparable to a monolithic silicon die that can be flip chip attached to the substrate. In this paper, we will discuss various assembly options and the challenges posed by each. In this investigation, we will propose the best method to do 2.5D assembly in an OSAT(Outsourced Assembly and Test) facility.
Technical Library | 2021-11-17 18:53:50.0
The demand for product miniaturization, especially in the handheld device area, continues to challenge the board assembly industry. The desire to incorporate more functionality while making the product smaller continues to push board design to its limit. It is not uncommon to find boards with castle-like components right next to miniature components. This type of board poses a special challenge to the board assemblers as it requires a wide range of paste volume to satisfy both small and large components. One way to address the printing challenge is to use creative stencil design to meet the solder paste requirement for both large and small components. ... The most important attribute of a stencil is its release characteristic. In other words, how well the paste releases from the aperture. The paste release, in turn, depends on the surface characteristics of the aperture wall and stencil foil. The recent introduction of new technology, nano-coating for both stencil and squeegee blades, has drawn the attention of many researchers. As the name implies, nano-coated stencils and blades are made by a conventional method such as laser-cut or electroformed then coated with nano-functional material to alter the surface characteristics. This study will evaluate nano-coated stencils for passive component printing, including 01005.
Industry News | 2010-04-11 03:29:20.0
HONG KONG - WKK Distribution Ltd., the leading supplier of industrial machinery and materials in Asia, announces that it has been awarded an NPI Award in the category of Exposure Equipment for its X-Pose SM120 Exposure System. The award was presented to the company during a Tuesday, April 6, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas during APEX 2010.
Industry News | 2010-05-04 21:09:23.0
Addressing the challenges posed by traditional greases and phase-change thermal interface materials, Henkel has developed and commercialized Loctite PowerstrateXtreme Printable (PSX-P), a new print-friendly thermal management product.
Industry News | 2024-03-11 18:17:03.0
In today's rapidly advancing electronics manufacturing landscape, achieving zero defects and maintaining stringent quality control standards throughout production processes are paramount. The precision alignment and attachment of components, particularly with flex circuits, can pose significant challenges that demand innovative solutions.
Used SMT Equipment | In-Circuit Testers
-178 dBc/Hz Noise floor lowering method: Two-channel cross correlation Frequency and power test: Parameters: Frequency and power Sweep type: DC power voltage or DC control voltage Transient tests: Parameters: F
Industry News | 2006-05-25 19:52:40.0
Engelmaier Associates, L.C. announces the availability of a multi-client study/white paper titled: "WHITE PAPER REPORT: Recommendations for PCB FAB Notes and Specifications in Printed Circuit Board Drawings for SnPb and Lead-Free Soldering Assemblies, the Qualification of PCB Shops and Activities to Assure Continued Quality."
Industry News | 2008-03-20 16:05:24.0
NASHVILLE � March 2008 � Kyzen Corporation, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will present during the technical conference at APEX 2008, scheduled to take place April 1-3, 2008 in Las Vegas.
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