About 2 part silicone Metering, Mixing and Dispensing System The 2 part silicone Metering, Mixing and Dispensing System accurately meters, mixes and dispenses two-component materials like potting compounds, encapsulants, casting materials and adhesi
New Equipment | Solder Materials
SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages
Electronics Forum | Sun Jun 30 20:00:56 EDT 2002 | redmary
the SOIC encounter solder crack after reliability test, the common process is: SMT---manual soldering---IPT(in process test)---potting---T/C(thermal cycling,only add current and voltage)---B/T and F/T (burn in and functional test). the condition is 2
Electronics Forum | Mon Jul 01 20:42:54 EDT 2002 | davef
Comments [questions] are: * It�s strange that an uggie ol� SOIC, 50 pitch, BIG honkin� solder pad, kinda thang is failing. Sumpin aint kosher, yano? * Where is the failure occurring [ie, lead to pad, pad to board, etc]? Talk about the breadth and di
Industry News | 2011-12-30 23:26:12.0
Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.
Industry News | 2022-04-28 14:30:28.0
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will highlight an array of award-winning inspection and measurement solutions at SMTconnnect in booth 4.A-233 on the NürnbergMesse event grounds during 10-12 May 2022. The following is just a glimpse into what Koh Young will have in store for our visitors at the tradeshow:
Technical Library | 2021-08-11 01:00:37.0
Conformal coatings and potting materials continue to create issues for the electronics industry. This webinar will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available. Similarly, this webinar will look at the failure modes of potting materials, (e.g Glass Transition Temperature (Tg), PCB warpage, the effects of improper curing and potential methods for correcting these situations.
SMTnet Express, August 12, 2021, Subscribers: 26,820, Companies: 11,423, Users: 26,800 Analysis of the Influence of Shrinkage Tensile Stress in Potting Material on the Anti-Overload Performance of the Circuit Board In this article
Technical Overview of Flex Mitigation Solutions News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Technical Overview of Flex Mitigation Solutions Flex cracks have been known
.gif)
