Industry Directory | Manufacturer
Leading manufacturers of small, powerful Forth embedded computers with low power consumption. Ideal for applications using datalogging, GPS, CAN bus, multi-tasking, control systems and anything with LCD and keyboard.
Industry Directory | Consultant / Service Provider
FP Instruments is a hardware and embedded systems design house based in Poland. Our specialty are IoT devices where wireless communications, data management and low power consumption requirements all come together.
KS-2425Z4 desktop SMT pick and place machine is a current market fastest actual mounting speed, the most stable performance and the best quality equipment. With marble mounting platform, 4 Heads +56 Feeder stations in one take and stick, support pneu
A500, A600, A800 - 5, 6 or 8 top/bottom cooling zones. Heating System: Up to eight groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air co
Electronics Forum | Tue Dec 06 09:38:13 EST 2011 | pszumny
Thanks, is it continuos connsumption or during start up ?
Electronics Forum | Sat Dec 17 18:12:04 EST 2011 | pszumny
Thanks eadthem.
Used SMT Equipment | AOI / Automated Optical Inspection
Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:
Used SMT Equipment | Flexible Mounters
Product Name: Samsung multi-function SM421 chip mounter Product number: SM421 Detailed product introduction Samsung multi function SM421 chip mounter Mounting speed: 21K CPH /QFP (IPC9850) 5.5K CPH Chip (IPC9850) The corresponding components: Ma
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Industry News | 2003-05-22 08:14:29.0
RF module reference designs have been developed so that the customer can take the radio design and drop it right into their PCB or build a separate module
Parts & Supplies | Semiconductor & Solar
Product number: YG200 Products in detail Yamaha YG200 high-speed SMT machine Speed: 0.08 seconds/CHIP (IPC9850conditions) 1608 CHIP: 34800 CPH (0.103 seconds/CHIPconversion) 16 pinsop: 24400 CPH (0.147 SEC/SOPconversion) (Max 80 varieties
Parts & Supplies | Chipshooters / Chip Mounters
Product name: YG200 YAMAHA medium speedchip mounter Product number: YG200 Products in detail Yamaha YG200 high-speed SMT machine Speed: 0.08 seconds/CHIP (IPC9850conditions) 1608 CHIP: 34800 CPH (0.103 seconds/CHIPconversion) 16 pinsop:
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
Technical Library | 1999-05-06 10:42:58.0
Many of us tend to think of semiconductors as low power, cool devices. But as the number of transistors in an integrated circuit increases, so does power consumption increases and the need to dissipate the resulting heat load. Microprocessors, in particular, consume more and more power with increase in speed and complexity.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
ZEVAv selective soldering machine delivers the best value in the high-speed selective soldering market. The ZEVAv platform leverages proven, market-leading fluxing, preheating and soldering technology to meet the growing challenges of high yields, co
Events Calendar | Tue Jun 02 00:00:00 EDT 2020 - Thu Jun 04 00:00:00 EDT 2020 | Markham, Ontario Canada
International Conference for Electronics Hardware Enabling Technologies (ICEHET)
Events Calendar | Tue Jun 14 00:00:00 EDT 2022 - Wed Jun 15 00:00:00 EDT 2022 | Toronto, Ontario Canada
International Conference for Electronics Hardware Enabling Technologies (ICEHET)
Career Center | chennai, India | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support
Two years working in EMS(process and Equipment Engineer)
Career Center | chennai, Tamil nadu India | Engineering,Production
KEY SKILLS; 1.PRINTING, PICK AND PLACE MACHINE OPERATION, 2.REFLOW OVEN CHARACTERISTICS, 3.IPC STANDARD,QUALITY POLICIES 4.AOI PROGRAMMING 5.c,c++LANGUAGES. 6.VerilogHDL. 7.ORCAD,PSPICE software known.
Void Detection in Large Solder Joints of Integrated Power Electronics SMTnet Express December 6, 2012, Subscribers: 26051, Members: Companies: 9064, Users: 34032 Void Detection in Large Solder Joints of Integrated Power Electronics by: Patrick
KingFei SMT Tech | https://www.smtspare-parts.com/sale-11298662-yamaha-yg200-yv100xg-electronic-feeder-power-station-24v-for-8mm-12mm-feeder.html
),550kg Power consumption: 200V-230V AC 50/60Hz Get Best Price DIP Pre-wave soldering AI AOI SMT Equipment AI AOI Part Name: SMT machine Part Number
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_madell_tabletop_reflow_oven.html
Madell Tabletop Reflow Oven Madell Reflow Tabletop Oven 5 Heating Zones - 1 pre-heat, 3 heat, 1 exit heat Max. PCB width 12 inches Mesh Belt Power consumption 5KW IR+convection
