Industry Directory | Manufacturer
Wisman High Voltage Power Supply Co.,Ltd, is the professional X-ray generator, DC high voltage power supply, PCB mount module and X-ray source manufacturers.
Industry Directory | Manufacturer
Designer and manufacturer of FADOS 7F/1 FAult Detector & OScilloscope; used for REPAIRING and TESTING THE ELECTRONIC and COMPUTER CARDS.
New Equipment | Board Handling - Conveyors
technical parameter： Model 1200 Track length 1200mm Supply power Ac220v/ single phase 50/60hz PCB size Wide 50-400 mm We
.jpg)
Automatic SMT Splicing Machine BMM08G/G_Plus Functional advantages ▶Simple operation: 5 minutes to learn to operate, everyone can operate, reducing dependence on personnel. ▶Foolproof and error-proof: Automatically scan the code to compare and prev
Electronics Forum | Fri Apr 26 12:39:05 EDT 2013 | mmjm_1099
First started with having to replace the power supply in the computer. Once we did this now I am getting a "power failure detected" error on the screen as an alarm for the oven program. Anyone have some advice or input on this?
Electronics Forum | Fri Apr 26 15:00:44 EDT 2013 | leemeyer
This is what the manual says about this message : Power Failure Detected A main power failure occurred and the machine is being powered by the UPS. All heaters are shut off immediately ad the conveyor clears all boards If main power is not restored w
Used SMT Equipment | In-Circuit Testers
2006 Seica Strategy In-Circuit Tester Power: 110V; 60Hz Note: The system passes all system diagnostics. It will be licensed and supported by Seica. Features: O/S: Windows 7 960 Analog Channels Open IC Pin Detection Manual Bar Code R
Used SMT Equipment | X-Ray Inspection
• Nordson DAGE VR950 new technology, open, transmissive X-ray tube: -All voltages can reach <0.95 micron feature resolution – The highest voltage is 160KV, target power: 3W -Long service life of filament components -Automatic st
Industry News | 2003-03-12 08:28:44.0
CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.
Industry News | 2003-06-26 09:02:38.0
The surface quality of printed circuit boards and components directly impacts performance and product life.
Parts & Supplies | Pick and Place/Feeders
GFC-SE03 SIEMENS Feeder Storage Cart GFC-SE03 SIEMENS Feeder Storage Cart The feeder storage cart gives your operators a secure place to put unused feeders between set-ups minimizing failures due to improper storage or handling. When its time to
Parts & Supplies | Pick and Place/Feeders
GFC-SE03 SIEMENS Feeder Storage Cart GFC-SE03 SIEMENS Feeder Storage Cart The feeder storage cart gives your operators a secure place to put unused feeders between set-ups minimizing failures due to improper storage or handling. When its time to
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
Technical Library | 2023-12-18 11:33:57.0
Elevate your electronic manufacturing game with the I.C.T-D600 SMT Dispensing Machine! Precision, safety, and efficiency in one powerful solution. In the dynamic realm of electronic manufacturing, precision and efficiency are not just preferences but essential requirements. Introducing the I.C.T-D600, an automatic glue dispenser machine engineered to enhance production processes across various applications. From chip encapsulation to PCB assembly, SMT red-glue dispensing, LED lens production, and medical device creation, SMT dispensing machine is a versatile solution tailored to meet the demands of the industry. Essential Attributes Of The I.C.T-D600 Automatic Glue Dispenser Machine 1. Compliance with European Safety Standards: The I.C.T-D600 SMT dispensing machine prioritizes not only efficiency but also safety, boasting compliance with European safety standards and holding a CE certificate. This ensures a secure and reliable manufacturing environment, aligning with global quality benchmarks. 2. International Component Quality: Internationally renowned components form the core of the D600 SMT dispensing machine. From Panasonic servomotors to MINTRON CCD, each element is carefully selected, guaranteeing high performance and durability. This commitment to quality components results in a machine that operates seamlessly, reducing downtime and maintenance costs. 3. Impressive Performance Metrics: The SMT dispensing machinedoesn't just meet expectations; it surpasses them with exceptional performance metrics: Maximum Guide Rail Speed: 400mm/s Fastest Injection Valve Speed: 20 spots/sec Dispensing Accuracy: ±0.02mm Repeated Accuracy: ±0.01mm Machine Characteristics: Core Part – Jet Valve The non-contact jet dispensing method ensures high-speed operation (max jet speed: 20 spots/second), high accuracy with a minimum dispensing volume of 5nl, and flexibility with extremely small dispensing volumes. The thermostatic system for the flow channel and sprayer ensures uniform glue temperature, resulting in low maintenance costs and an extended service life. Enhanced Capacity: Non-contact jet dispensing eliminates the need for Z-axis motion. Integrated temperature control technology reduces manual intervention. Automatic glue compensation minimizes artificial regulation time. Dual-track design reduces waiting time. Automatic visual location identification and compensation. Non-contact height detection with laser reduces height detection time. Flexibility: Capable of handling substrates or backings of various sizes. Optional heating module. Independent control of dual tracks with user-friendly software. Fast switching between different product lines. Universal platform suitable for various processes with different glues
ML-2500S PCB Separator uses high speed rotation milling cutter to separate PCB array. Widely applied in digital, communication, lighting, etc. Which improved the defect on PCB separating caused by manual, V-cut, stamping, etc If you have any questi
Broader scope, the latest ultra-small SMD components (01005) count, the series is as follows: These are the components package specifications. Functions: 1, Empty chip detection capabilities SMD chip counter, the job is simple, positive and neg
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Mar 25 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | ,
Webinar: Process Control to Ensure Electrochemically Reliable Electronics
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Sugar Land, Texas USA | Production
Ability to troubleshoot to componenet level of analog and digital circuits. Ability to read schematics and failure analysis. Experience with incircuit and functional testing needed. Will test and debug to customer specifications. Perform set up
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Career Center | North York, | Engineering,Quality Control,Technical Support
GSM/EDGE, CDMA, UMTS cellular networks, WCDMA, Inukshuk networks, SS7, HSPA, TDMoIP, IP, TCP/IP, Ethernet, Messaging and Data Networks, Radio Prop
Void Detection in Large Solder Joints of Integrated Power Electronics SMTnet Express December 6, 2012, Subscribers: 26051, Members: Companies: 9064, Users: 34032 Void Detection in Large Solder Joints of Integrated Power Electronics by: Patrick
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-dages-peter-koch-to-discuss-failure-analysis-with-xray-at-epps-innovations-forum
Nordson DAGEs Peter Koch to discuss failure analysis with Xray at EPPs Innovations Forum X-Ray Inspection and Test Products Corporate | Global Directory
Blackfox Training Institute, LLC | https://www.blackfox.com/everything-you-need-to-know-about-esd-management/
. This type of failure can be detected when the device is tested prior to shipment. But if the device sustains ESD damage after testing, it might not be detected until the device reaches the
.gif)
