1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Industry News | 2015-10-28 15:22:47.0
EMS provider Micro Industries in Westerville, Ohio will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for this event will open promptly at 8:00am EST on December 1, 2015 and the closing will begin at 11:00am EST on December 3, 2015
Industry News | 2015-11-28 10:47:28.0
EMS provider Micro Industries in Westerville, Ohio will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for this event will open promptly at 8:00am EST on December 1, 2015 and the closing will begin at 11:00am EST on December 3, 2015.
Parts & Supplies | Assembly Accessories
HELLER REFLOW MOTOR CP6383 CBM-9230 Capacitor -run induction motor Model Number CBM-9230 CP6383 Input Voltage 210-240V Frequency 50/60 Hz Power 83W
Make: Heller Model: 1809 EXL Vintage: 09-2007 Details: (9) Top & Bottom Heating Zones (2) Cooling Zones Windows 7 Operating System Edge Rail Conveyor & Center Board Support Air S
适用于大尺寸PCB板及双轨道生产的世界一流的SMT 回流焊炉 随着最新的技术突破，HELLER推出了全新的MARK 5回流焊系列，为客户提供了更为经济的方案。新型的加热和冷却技术能最大限度 地减少氮气和电力消耗，省氮省电高达40%。因此，MK5系列不仅性能卓越，更是业界最具经济价值的回流焊系列产品。 选择适合您制程需求的回流焊设备 1826MK5 回流焊炉 - 这些马力为高容量要求提供了稳定的性能，同时大大减少预防性保养的时间及空间占地。 1936MK5/2043MK5 回流焊炉 -
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
4 Vreeland Rd.
Florham Park, NJ USA
Phone: 973-377-6800
