Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
PPM has released a new "Cut Tape Feeder" for working with less than a reel of components. Manufactures are now able to pick from short sections of taped components. The feeder is leader less, manually indexed, latches into the feeders bases of the
3550 sq. mm second (> 5.5 sq. in / second) Maximum Board Size: 350mm x 250mm (14 x 10 in.) Minimum Board Size: 50mm x 50mm (2 x 2 in.) Topside Clearance: 25mm (1 in.) Bot
Don't Sacrifice PCBs for Profiling Double Sided Thermally Conductive Tape Used for Attaching Thermocouples to PCBS. Non-destructive TC attachment Reliable TC readings No waiting for curing or soldering Fast, easy setup Sold in 1
New Equipment | Test Equipment
Quickshot XRF already offered a Handheld XRF analyzer for detection of hazardous substances but realized a need for analysis of small electronic components...to meet this interest the desktop QSX-82D was developed. This efficiently designed system
S3088 ultra with high-performance sensor technology XM 3D - the new standard in assembly inspection. High-speed solder joint inspection. Highest inspection depth. Simple operation. In today's electronics manufacturing environment, reliable and econ
Product Name MUA Power（W） 6W,20W,30W Output Voltage(KV) ,0.062,0.125,0.250,0.5,1,2,4,6, ISO9000:2008 certified precision module .The MUA Series is ideal for OEM applications requiring a competitively priced, precision high voltage module.
This is a brief demonstration showing the 2014 YESTech FX operating. This machine is available at the Capital Equipment Exchange. www.ce-exchange.com
