Electronics Forum | Tue Apr 13 18:39:24 EDT 1999 | Tom B
| | Netters, | | | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | | | 1. Kester 293 no clean | | 2. 2.1 C/s for 30s to 150 C | | 3. .5 - .7 C/s f
Electronics Forum | Tue Apr 13 23:08:56 EDT 1999 | Jeff Sanchez
| | | Netters, | | | | | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | | | | | 1. Kester 293 no clean | | | 2. 2.1 C/s for 30s to 150 C | | | 3.
Industry News | 2021-02-25 14:20:16.0
Koh Young is the industry leader in True3D™ measurement-based inspection solutions. We invite you to connect with us at the virtual IPC APEX Expo during 08-12 March 2021. At the event you can learn, collaborate, and bond with Koh Young from your office. Yes, the setting is different from in past years. Yet, we stay committed to the event and will highlight our innovative inspection solutions. What's more, you can request to schedule a free machine demonstration to see how we can solve your electronics inspection challenges.
Industry News | 2021-03-15 15:33:29.0
Koh Young is the industry leader in True3D™ measurement-based inspection solutions. We invite you to connect with us at the virtual IPC APEX Expo during 08-12 March 2021. At the event you can learn, collaborate, and bond with Koh Young from your office. Yes, the setting is different from in past years. Yet, we stay committed to the event and will highlight our innovative inspection solutions. What's more, you can request to schedule a free machine demonstration to see how we can solve your electronics inspection challenges.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
- The importance of controlling moisture levels during BGA reflow, as seen by BGA X-ray inspection. PCB Through Hole Component Quality Soldering Process Improvement of Critical SMT Connectors - Using X-ray inspection and mechanical pull testing to optimize wave soldering process parameters for high density connectors
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gas phase Formic Acid (HCOOH) to replace standard fluxing agents Eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps No post-reflow flux clean facilitates inline application of epoxy and inline epoxy
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