Industry Directory | Equipment Dealer / Broker / Auctions
TrioTek™ inline, conveyor curing ovens from ETS are ideal for medium to high-volume curing/drying of coatings, adhesives and potting compounds.
Industry Directory | Manufacturer
Manufacturer of Fluid Dispensing Equipment for Selective Conformal Coating, Potting, Encasulation & Underfill including Inspection, Conveying and Curing. Total Solution Fluid Dispensing & Conformal Cocating Process Lines.
New Equipment | Board Handling - Pallets,Carriers,Fixtures
* Provides dimensionally stable support platform for PCB * Protects SMT components from heat or thermal shock * Reduce/eliminate manual labor for hand masking operation, glue dotting, and hand soldering * Reduce solder defects (ex. Bridges and skips)
New Equipment | Cable & Wire Harness Equipment
Hex head screw threaded water heater boilers NTC thermistor temperature sensor Application: NTC thermistor temperature sensor probe for temperature measurement of liquid, water, air, etc. Typical application coffee maker, tea kettle, drinking water,
Electronics Forum | Sat Jan 03 18:13:58 EST 1998 | David Jacks
Tom: You are right. Pre-heating is just as necessary in rework as it is in intiial production. Zephyrtronics produces an economical convective bottom side pre-heater known as an airbath. This product ramps the substrate and assembly at 2-4 degrees
Electronics Forum | Sun Jan 11 11:28:14 EST 1998 | Bob Willis
Most componnent cracking is mechanicaly produced a guide to causes of capacitor damage is included as a download file on my web page www.bobwillis.co.uk I feel that the supplier is looking to blame some one else. IPC make comment on pre heating chip
Used SMT Equipment | Soldering - Selective
Pillarhouse Jade MKII Selective Soldering Machine Model: Jade MKII Year: 2016 Lead-Free Drop Jet Fluxer Top Side IR Pre-Heat Auto Soler Top-Up & Solder Level Detect Inerted Nitrogen System Thermal Nozzle Calibrati
Used SMT Equipment | Soldering Equipment/Fluxes
Air-Vac Solder Reflow System, Model: PCBRM System 5.2, Includes footswitch Complete Capability for Low Volume Automated Selective Soldering of Through Hole Components Fume Extraction Manifold Option The PCBRM System 5.2 has all of the feature
Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
Industry News | 2020-01-07 11:09:15.0
IPC-8921 establishes classifications and designations for woven and knitted e-textiles integrated with e-fibers, e-yarns and e-wires. It also standardizes key characteristics and durability testing for these materials as well as the industry test methods to be used to test against those characteristics.
Parts & Supplies | Chipshooters / Chip Mounters
> JUKI ESL13000000 VACUUM PAD 15 JUKI ESL13000100 PHOTO MICRO SENSOR A JUKI ESL13001000 TUBE union (KL700) JUKI ESL130011A0 CONVEYOR MOTOR (KZ500) JUKI ESL13002000 CLAMP LEVER JUKI ESL13003000 T TYPE NUT JUKI ESL130031A0 OPERATION PANEL (KL700) JUKI
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Parts & Supplies | Assembly Accessories
> JUKI ESL13000000 VACUUM PAD 15 JUKI ESL13000100 PHOTO MICRO SENSOR A JUKI ESL13001000 TUBE union (KL700) JUKI ESL130011A0 CONVEYOR MOTOR (KZ500) JUKI ESL13002000 CLAMP LEVER JUKI ESL13003000 T TYPE NUT JUKI ESL130031A0 OPERATION PANEL (KL700
Technical Library | 2023-08-16 18:25:16.0
In one of our Consumer Electronics projects, a leader of networking technologies requested to test dispensing performance of a thermally conductive material, Fujipoly Sarcon SPG-50A. This material improves heat dissipation for higher frequency applications and reduces the negative effects of thermal resistance under heat, cold, humid, and thermal shock conditions. The customer's goal was to dispense a 1mm diameter dot with acceptable speed and consistency.
Technical Library | 2022-09-25 20:18:33.0
Printed circuit board (PCB) bending and/or flexing is an unavoidable phenomenon that is known to exist and is easily encountered during electronic board assembly processes. PCB bending and/or flexing is the fundamental source of tensile stress induced on the electronic components on the board assembly. For more brittle components, like ceramic-based electronic components, micro-cracks can be induced, which can eventually lead to a fatal failure of the components. For this reason, many standards organizations throughout the world specify the methods under which electronic board assemblies must be tested to ensure their robustness, sometimes as a pre-condition to more rigorous environmental tests such as thermal cycling or thermal shock.
Flexible, in-line, modular selective soldering system Designed as a modular system, the Synchrodex range of in-line equipment offers the ultimate in flexibility with the ability to upgrade to high speed throughput when multiple modules are placed to
To see more about the Jade MKII Single Point Selective Soldering System visit Pillarhouse USA at: https://www.pillarhouse.co.uk/products/selective-soldering-handload/jade-mkii-handload Entry-level, single point selective soldering system Designed t
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization
Events Calendar | Tue Mar 06 00:00:00 EST 2018 - Tue Mar 06 00:00:00 EST 2018 | ,
Electronics in Harsh Environments Conference - Free Pre-Conference Webinar
Career Center | Rochester, New York USA | Engineering
Our high tech client located in the Western NY State area offers you the following challenge. Complete mechanical design responsibility from specification to the manufacturing process. We seek a candidate that has the following experience: Design
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Fort Mill, South Carolina USA | Engineering,Maintenance,Research and Development
Have serviced AMF pinspotters both mechanical and electrical sides; included repair of chassis pc boards to component level. 20 years in this field. Have worked in PCB manufacture with old style board populators and Panasert robots Worked in H
Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution News Forums Equipment Mart Company Directory Event's Calendar Career Center Advertising Thermal Residue Fingerprinting: A Revolutionary Approach
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/thermal-interface-material-tim?con=t&page=3
Thermal Interface Material (TIM) | Nordson ASYMTEK ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
Interconnect Solder Joints,” Proceedings of SMTAI 2006, 393-405, Chicago, IL, September 2006. [11] Donghyun Kim, Ken Hubbard, Bala Nandagopal, Mason Hu, Sue Teng, Ali Nouri, “Effect of Voiding on Solder Joint Shock and Thermal Reliability,” Proceedings of IPC
