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Knitted Mesh Gaskets

Knitted Mesh Gaskets

New Equipment | Materials

Knitted wire meshes are produced from a single continuous filament and produce very high levels of EMI shielding performance when evenly compressed between two metallic contact surfaces. Our KP Series meshes are available in four basic wire types –

P&P Technology Ltd

Immersion gold VS Plating gold

Videos

There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious tr

Headpcb

Manncorp Debuts 2-Pot Dual-Wave Solder Machine For Easy Lead-Free / Pb Switchover

Industry News | 2011-10-05 13:32:18.0

CB assemblers - particularly contractors -faced with the need to go lead-free while maintaining a tin/lead soldering presence, will welcome Manncorp’s 16.350 wave solder machine. In place of the usual single pot, the 16.350 can now be configured with two pots on roll-out carts to provide lead-free-to-Pb switching with ease.

Manncorp

Space Is Filling Quickly for SMART Group’s 2015 European Conference & Exhibition

Industry News | 2015-05-22 16:09:16.0

Reservations from overseas for delegate places and bookings for Table Top Exhibition space are already being received for the SMART Group European Conference & Exhibition, which will be held at the National Physical Laboratory (NPL), one of the UK’s leading science and research facilities based in Teddington, London, on the 22nd and 23rd September 2015.

The SMART Group

Circuit Technology Center Announces New Component Trim and Form Service

Industry News | 2023-11-13 12:31:47.0

Circuit Technology Center announces it has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. They can also propose a trim and lead-form drawing if needed. Dedicated, custom tooling can be fabricated to meet custom package requirements.

Circuit Technology Center, Inc.

Lead Free & Tin/Lead Wave Soldering Defect Guide to Download

Industry News | 2017-03-08 10:49:36.0

Bob Willis has created many training videos and interactive CD-ROM over his many years working in industry. Based on over 30 years running training courses on wave soldering for process, quality engineers and operators on Electrovert, Blundell, Vitronics, SEHO and many other systems. Our Guide to Wave Soldering & Process Defects is now available as a download file for quicker delivery to your company from http://www.bobwillis.co.uk

ASKbobwillis.com

MANNCORP’S NEW LEAD-FREE COMPACT WAVE SOLDER MACHINE HAS FEATURES OF LARGER SYSTEMS

Industry News | 2010-04-30 20:40:07.0

Following numerous customer requests for smaller wave solder machines with many of the key features of larger ones, Manncorp has introduced System 16.350. It is a derivative of the 28.400, one of the best-selling high-volume wave solder machines the company has ever offered, according to CEO Henry Mann.

Manncorp

Cleaning, activation and coating/metallization with cold-active plasma under atmospheric pressure. The new dimension in plasma treatment

Industry News | 2009-12-08 15:08:44.0

Reinhausen Plasma will be presenting the first ever cold-active plasma tools at the productronica – the Plasmabrush, Piezobrush and Plasmadust. The innovative Plasmabrush and Piezobrush open up a whole range of new application fields with regard to the pre-treatment and activation of substrate surfaces.

Reinhausen Plasma GmbH

Immersion gold VS Plating gold

Industry News | 2019-05-16 01:27:23.0

There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious treatment. Many people can't tell the difference between plating gold and immersion gold, thinking that it is the same thing, it is a big mistake. The following is a brief introduction to the difference between plating gold and immersion gold.

Headpcb

Indium Corporation Expert Presents at SMTA ICSR 2016

Industry News | 2016-04-21 19:00:55.0

Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will present at the International Conference on Soldering and Reliability (ICSR) 2016 on May 9-11 in Toronto, Canada. Sandy-Smith will present How Stencil Design and Reflow Profiles Affect Variation in QFN Voiding Data: A Case Study. This presentation will include data from several studies that demonstrate how stencil design and reflow profile optimization impacts voiding levels and variation in material comparison testing.

Indium Corporation


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