Quick Overview Lead Free Best Solution S400 is a CE certificated compact Lead Free Wave Solder Machine with inline finger conveyor, stepper driven spraying fluxer, hot air preheat zone & Ti dua wave solder pot. To Get More Informations Form Below
The VERSAFLOW 3/45 is the first in-line selective soldering machine with dual track transport. Highest flexibility and highest throughput can be realised with the smallest possible required space. Find our products ? https://www.kurtzersa.com/electro
New Equipment | Wave Soldering
Peak series soldering machine shows superiority in performance, stability, reliability, safety, operability and maintainability. Aims to reduce customer operational cost (especially reduced the solder dross and oxidation significantly) and improves s
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Used SMT Equipment | Soldering - Wave
Electrovert Econopak Plus 400/F Wave Soldering System for Sale Vintage 1997 Specifications: Foam fluxer with 13L capacity Chip wave nozzle LAMDA nozzle VectaHeat Preheater 2 Top side IR preheats Heater size 400mm Appro
Used SMT Equipment | Soldering - Selective
Max PCB or pallet size 310 x 410 mmMax PCB weight 10 kgSolder pot volume MW 180 kg / SW 45 kgMax soldering area 250 x 350 mmN2 consumption 75 L/minMaximum components height top side 120 mmPower supply 3 x 400V 50/60 HzCjhmhbg00wMachine size (L x W x
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
Industry News | 2010-05-11 14:20:41.0
VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces its updated IR Pre-heater Series, designed to preheat assemblies that require additional heat to compliment manual soldering and desoldering of SMT, through-hole and other thermal applications.
Parts & Supplies | Repair/Rework
. This machine adopts industrial computer control, full automatic vision alignment system can acquire BGA and the PCB image through the CCD camera and collect them on the image positioning processing system, calculate the offset position and angle th
Parts & Supplies | Repair/Rework
PG-P6800 Main Features： 1、There are 3 independent heaters. The 1st and 2nd hot-air heaters can control multiple groups and segments temperature parameters. The 2nd heater can move up and down. The 3rd large area IR heater can preheat the PCB boar
Industry News | 2012-05-30 18:07:43.0
In mid June PROMATION will release a new IR Pre-Heat system that will fit onto the companies TT-400 Table Top soldering robot. This 4 zone IR heater is designed to aid in soldering by removing thermal barriers to allow for better soldering results.
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