Industry News | 2014-05-15 16:32:40.0
Ongoing IPC Initiative to Open Dialogue Between Electronics Manufacturers and Policymakers
Industry News | 2010-09-22 15:01:40.0
Removing heat has become a major issue in the electronics industry as more highly integrated devices are jammed into less space and as high power devices, such as LEDs, become increasingly more common.
Industry News | 2014-09-30 18:36:10.0
IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards at IPC’s Fall Standards Development Committee Meetings yesterday in Rosemont, Ill. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.
Industry News | 2013-10-21 16:05:48.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards at IPC’s Fall Standards Development Committee Meetings last week in Fort Worth, Texas.
Parts & Supplies | Circuit Board Assembly Products
1). Laird aluminium backed 2). T-Prepreg 1KA Dielectric 3). Low Thermal Resistance for Cool & Efficient LED Operation 4). 1.6mm thick, single sided, 1 oz 5). Black solder mask/No ident 6). CNC rout outline 7). Immersion gold
Industry Directory | Manufacturer
Manufacturer of PCB laminates. The products includes full series of FR-4 copper clad laminates, prepreg,CEM-1,CEM-3, etc.
Industry Directory | Manufacturer
Isola a global material sciences company focused on designing, developing, manufacturing and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer PCBs.
Industry Directory | Manufacturer
Manufacturer of base materials for the PCB industry. Our main products are copper clad laminates (CCL), prepregs (PP) and Mass Lamination boards (Mass Lam PCBs).
Industry Directory | Distributor
Midwest Composites is a Sales Agency and distributor of composite materials. We carry Vulcanized Fibre, Phenolics, Prepregs, Molded Polyester Fiberglass, Asbestos Laminates, Graphite, Kevlar® and other engineered materials.
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
