Technical Library | 2020-01-09 00:00:30.0
PCBs have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.
Technical Library | 2020-11-29 22:02:49.0
It has been over 25 years since the earliest edition of "Everything You Ever Wanted to Know About Laminates...but Were Afraid to Ask" was pounded out on an old TRaSh-80 Computer. It has undergone periodic review and editing, including adaption for use on our website. (When I entered the industry Al Gore had not yet invented the internet.) Before I "retired" in 2004, we did another minor revision, but it was largely cosmetic, removing most references to the old military specification and introducing IPC-4101, the "new" specification for laminate and prepreg materials.
We can supply Copper Clad Laminates used in manufacture of Printed Circuit Boards meeting international standards from India. Laminate Types : CEM1, CEM3, FR1, FR2, FR3, FR4 and Flexible. Thickness : 0.2 mm - 6.0 mm Copper Cladding : 1
Printed Circuit Boards meeting international standards are available from Indian Printed Circuit Board manufacturer. Complete range of UL approved products : Base Laminate : CEM1 , CEM3, FR3, FR4 and FR1, FR2, Flexible. Thickness
Innovative Materials, Superior Performance. Our printed circuit board and semiconductor packaging materials provide superior thermal and mechanical performance, a fact we’ve prided ourselves on for over 45 years. All our materials are RoHS complian
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
600V *RO4350B *RO4003C Dielectric material & Stack up requirement FR-4(no copper): 0.05-3.2mm for option Prepreg type: 7628H(7630), 7628(43%), 7628(41%), 2116HR, 2116, 2113, 1080 and 1060 for option Copper
FR408 High Speed, Low Loss Modified Epoxy FR408 is a high-performance FR-4 modified epoxy laminate & prepreg system designed for advanced circuit applications. Its low dielectric constant and low dissipation factor make it an ideal candidate for br
Industry Directory | Consultant / Service Provider / Manufacturer / Manufacturer's Representative
ChangDa was founded in 2001, it is a comprehensive company that engaged in R&D, production and marketing of thermal insulation and ESD reinforced plastics.
Industry News | 2018-11-28 19:27:27.0
Isola Group today announced that it has achieved IATF 16949: 2016 certification for our Chandler, Arizona headquarters and our facilities in Dϋren, Germany, Huizhou and Suzhou, China and Taoyuan and Yangmei, Taiwan.
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