Industry News | 2023-12-11 12:34:11.0
Ventec International Group Co., Ltd. (6672 TT). Following last year's investment in new prepreg treating capacity at its Taiwan facility, Ventec International Group continues to focus on diversifying its manufacturing footprint and capability for its VT-901 / VT-90H high performance polyimide laminates and prepregs.
Industry News | 2017-07-17 18:38:40.0
Isola Group has named industry veteran Michael White to the newly created position of Chief Revenue Officer.
Industry News | 2023-11-13 12:22:31.0
Ventec Giga Solutions, the equipment division of Ventec International Group announces its appointment by Sunus Precision Machinery as sales agent and distributor of Vacuum Filling Holes Solutions and Screen Printing Equipment. The agreement covers all regions globally outside of Asia.
Tachyon-100G laminate materials are designed for very high-speed digital applications up to and beyond speeds of 100 Gb/s. Tachyon 100-G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature
Industry News | 2013-07-22 17:01:59.0
Isola Group S.a.r.l. announced today its new low loss, low skew, high-speed material, GigaSync™. This product has been engineered to eliminate skew issues in high-speed designs that use differential pairs to create a balanced transmission system able to carry differential (equal and opposite) signals across a printed circuit board.
Industry News | 2014-06-26 20:12:53.0
Isola Group announced the introduction of Tachyon-100G laminates and prepregs, which enable line cards required to transmit 100 Gigabit Ethernet (100GbE) at data rates in excess of 25 Gb/s per channel. Tachyon-100G has identical electrical properties as its predecessor Tachyon; however, the Z-axis coefficient of thermal expansion (CTE) on Tachyon-100G is more than 30% lower than Tachyon, making it more suitable for fabricating high-layer count, 0.8 mm pitch line cards with heavy 2 oz. copper inner layers.
Industry News | 2015-09-10 17:02:54.0
Ventec Europe will present a paper entitled 'Making the right decisions at the right time in the PCB design process' at the 2015 SMART Group European Conference & Exhibition. The conference will be held on the 22-23rd September at the National Physical Laboratory (NPL), one of the UK’s leading science and research facilities, located in Teddington, London.
Industry News | 2017-06-07 11:51:15.0
Isola Group, the leading global and local manufacturer of copper-clad laminates and dielectric prepregs for use in the PCB boards announces it will exhibit at the IMS Exhibition June 6-8, 2017 at the Hawai’i Convention Center in Honolulu, Hawaii. Isola will display in booth #1008.
Industry News | 2022-01-29 13:23:58.0
Ventec International Group (6672 TT) is pleased to announce that its US facility in Fullerton (CA), is now certified according to AS9100 Revision D and ISO 9001:2015, the quality-management standard for the aviation, space, and defense industries.
Technical Library | 2019-05-01 23:18:27.0
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.
