Electronics Forum | Wed Jul 22 06:58:50 EDT 2015 | migliore
Hi, I got the answer from edaboard.com A standard 6-layer stack is using 2 cores. Manufacturing steps for standard 6-layer are: 1. Etch both (double side) core substrates 2. Assemble, press and cure the complete stack: - copper foil - prepr
Electronics Forum | Fri Mar 03 16:05:42 EST 2006 | Chris
Hi, Anyone ever perform a DOE on prepreg glass bundle direction or glass bundle grain and how or if it affects PCB warpage and chip component cracking at V-score depanel? Since most FR4 and prepreg has has 1.4 times more fiber bundles in one direct
Electronics Forum | Mon Mar 06 17:57:39 EST 2006 | slthomas
Not here, but I'd be interested in hearing what you found.
Electronics Forum | Thu Jun 25 22:25:24 EDT 2009 | boardhouse
In the life of this product that you have been doing this process, has the material alway's been IT180 material? One problem with Lead free material is that it is more fragile that standard FR4 Epoxy laminate. And is known to have chipping or fractu
Electronics Forum | Tue Nov 04 08:45:52 EST 2014 | julianf
BUMP, Still looking :)
Electronics Forum | Thu Sep 20 13:06:37 EDT 2007 | hussman
Acualy same supplier, but they have 7 different facilities. Changes in prepreg thickness from lot to lot is the big deal, since internal shorting occurs form time to time. Just wondering if there was a spec I could use to force them to use the same
Electronics Forum | Wed Apr 08 14:46:34 EDT 2009 | boardhouse
The things to ask your board supplier would be: 1) Was the Pre-preg material that was used on this board within its Shelf life? and ask for the Incoming inspection CofC for the Pre-preg material. 2)Was this order shipped from Stock - this is why
Electronics Forum | Mon Mar 27 20:52:22 EST 2000 | Dave F
Marc: In printed circuit board fabrication, fabricators place sheets of prepreg between each pair of glass cores. They stack these layers into books. As they heat and press the books, the sheet melts into an epoxy glue. The thickness of the prepr
Electronics Forum | Thu Nov 16 11:45:15 EST 2006 | markb
I still think the best bet is probably an SMT pre-bake operation to ensure that there is no moisture in the board. Vapor pressure is usually the leading cause for delamination, so removing the source should significantly help out. Unfortuantely, pr
Electronics Forum | Thu Aug 26 07:38:07 EDT 1999 | Robert Meston
Has anyone any experience in using Arlon thermabond as a prepreg between polyimide substrates and alluminium heatsinks, Does it really make any difference to the CTE etc ?
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