Full Site - : press fit vs through hole (Page 6 of 9)

Preview for Seica Inc. – Las Vegas, Nevada, IPC Apex March 15-17, 2016, booth # 2310 In the ramp light: Automation and Industry 4.0

Industry News | 2016-02-03 12:04:47.0

The theme for Seica at Apex this year will be automation and Industry 4.0. Highlights will include the traditional Compact line of bed of nails and functional testers; the Pilot line, a truly versatile and multi-faceted flying probe system; its Mini line of benchtop ATE, and the Firefly line, a premier laser selective soldering system.

3M Electrical Solutions Division

Joel Scutchfield from Koh Young will Discuss the Journey to Realize AI for the Electronics Industry at the SMTA Ontario Conference on 16 October 2023

Industry News | 2023-10-09 09:17:14.0

Koh Young Technology will discuss the increasingly significant role of data collection and analysis to enable Generative Artificial Intelligence (GenAI) functionality to improve productivity in our industry. On 16 October during the one-day SMTA Ontario Technical Conference, Joel Scutchfield, General Manager of SMT Business Operations and Director of Sales at Koh Young America will discuss how electronics manufacturers can boost efficiency, improve flexibility, and even achieve self-optimizing processes.

Koh Young America, Inc.

Ray Welch from Koh Young will Present a Paper on the Importance of Solder Paste Inspection at SMTA Tampa Bay Expo on 30 October 2023

Industry News | 2023-10-23 09:57:34.0

Koh Young Technology, the leader in True3D™ measurement-based inspection solutions changed the industry over 20-years ago with its multi-projection solder paste inspection machine. The electronics manufacturing industry quickly adopted the patented technology, which is now the de facto standard SPI machine in the market. On 30 October during the SMTA Tampa Bay Technical Forum, Ray Welch, Senior Applications Engineer at Koh Young will discuss the growing importance of SPI as a process improvement tool.

Koh Young America, Inc.

Koh Young highlighting Award-winning True3D™ Inspection Solutions at SMTA International 10-11 October 2023

Industry News | 2023-09-11 17:44:46.0

Koh Young Technology will be presenting whitepapers and delivering live demonstrations of its award-winning inspection and measurement solutions in Booth 1421 at the Minneapolis Convention Center in Minnesota on 10-11 October 2023. The following is just a glimpse of what Koh Young will have in store for our visitors:

Koh Young America, Inc.

Ivan Aduna from Koh Young will Present a Paper on How AI Supports Realtime Process Control at SMTA International 10-11 October 2023

Industry News | 2023-09-13 16:07:28.0

In addition to bringing several of its industry-leading True3D™ measurement-based inspection solutions to SMTA International for live demonstrations, Koh Young, the premier show and expo sponsor, is excited to announce Ivan Aduna, Global MES Manager will present a paper about how AI-powered tools can support real-time process control. During the technical conference on Wednesday, 11 October at 11:00am Ivan will present his paper in the "AI and Machine Learning" session in room 202 A/B.

Koh Young America, Inc.

A Confluence of Expertise: Lean Stream, Fuji America Corporation, and Koh Young America Unite to Unveil a New Collaborative Workspace

Industry News | 2024-02-19 12:09:35.0

In a groundbreaking move set to redefine the landscape of electronics manufacturing in the SiliconValley and the Bay Area, Lean Stream, Fuji America Corporation, and Koh Young America have come together to launcha state-of-the-art collaborative workspace in Fremont, California.

Koh Young America, Inc.

Surface Tension vs Part Mass

Electronics Forum | Tue Sep 12 22:03:22 EDT 2006 | davef

Really Rocky? What's the meaning of Russ' "if it will fit" in your scheme? As an alternative to your scheme, he could glue the nut on its side, tie a string through the hole in the nut, attach the other end of the string to the open door, and the

Press Fit vs. Through Hole Joint Quality

Electronics Forum | Tue Jul 14 13:47:53 EDT 1998 | Mark Barnett

There's a battle brewing around here regarding the use of press fit connectors in place of their thru hole counterparts because of suuposedly better reliability. Is there any validity to this statement? Up until now, we have only been going with pr

Re: Press Fit vs. Through Hole Joint Quality

Electronics Forum | Wed Jul 15 15:35:21 EDT 1998 | Michael Fogel

Hello Mark, Here in ECI, because the nature of our products, are using the method of press fit connectors in big numbers and although we have SMT components (around 200 per board) as well as T/H components we still preferred to use press fit because

Re: Press-Fit

Electronics Forum | Tue Nov 07 09:26:37 EST 2000 | Peter Barton

Adam, The most common cause for this problem is a variation in the plating thickness of the through holes, particularly if they are Sn/Pb solder levelled PCB's. Most pressfit connectors require a fairly tight control on the diameter of the holes to


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