Electronics Forum | Thu Apr 18 14:00:35 EDT 2002 | Romain
Is anyone has experience on problems with press-fit on Ni/Au board finish. Connectors pins are SnPb finished. I am particulary interested by experiences or documentation in very agressive environmental conditions (avionics or space buisness) Thanks r
Electronics Forum | Mon Apr 29 03:16:43 EDT 2002 | Bob Willis
I have only seem problems so I would suggest you don't do it.
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Adhesives Geoff Rivers, Pearl Lee-Sullivan, Boxin Zhao, Alex Chen, John Persic and Robert Lyn Abstract 30-3 Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating -Influence of Electroless Pd
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Höllmüller LPI Developer with flexible transport Pill Pre-Clean Mec Etch Bond for paint + inner layers Höllmüller Anti-Tarnish for inner layers Mec Laif Shadow Line - Direct Metallization Laif Resist Stripper with cyclone Schmid Tin Stripper Laif Ni/Au manual electroplating w/post-cleaning + dryer Laif Ni/Au – chem
