Electronics Forum | Wed Dec 07 17:43:31 EST 2011 | mikenil
Hi I do not work for a board house but a manufacturing facility where we do a considerable amount of soldering wires to through holes. We pretin our through holes on both sides of the PCB prior to reflowing the solder and installing the conductor (w
Electronics Forum | Wed Jun 27 13:55:10 EDT 2001 | peterson
We are having some difficulty achieving 75% fill on some through-hole power connectors. The board is very thick. Any suggestions? Our plan is to preheat extensively, pre-tin the leads and perhaps add paste in hole. Anything else that might achieve th
Electronics Forum | Wed Jan 26 14:33:47 EST 2000 | Glenn Robertson
Tuan - How about Sn/0.7Cu? It's M.P. is 227 and it's readily available. If the leads are Gold plated you might consider pre-tinning them. If you need a higher temp alloy any of the major solder companies can help - I suggets you start with Ind
Electronics Forum | Wed Sep 18 15:13:17 EDT 2002 | davef
Effects of Gold (Au) on Solder Properties Concentration Range in Weight Percentage w/o Au in Sn63/Pb37 Solder [A Sugarman/Loranger] * 2.0 - 3.0% Spreadability and fluidity of solder reduced (1) * 3.0% Highest acceptable concentration of Au in solder
Electronics Forum | Fri Dec 13 18:47:22 EST 2002 | stefwitt
In theory you are right, but the camera CCD chip has only small squares as pixels. The edges of the circle lit the pixels only by a certain percentage. In order to find the edges, you will have to use sub-pixels or greyscales. A circle is also prone
Electronics Forum | Wed Jun 04 09:15:06 EDT 2003 | davef
We used to use 260+-5C (500+-10F) for Sn63, now we use 240-260C (460-480 F). You probably could get away with 232C (450F) in all cases, since there is no thermal mass to a lead being tinned. We keep our tinning temperature the same as our solder po
Electronics Forum | Tue Sep 22 08:35:47 EDT 2009 | cman
Did you try pre-tinning your board on this suspect pad/s to see if it improved wetting/solderability prior to printing/SMT placement and reflow? Does the pad/s not soldering tie to a ground layer? I would connect a T/C to each pad of the same part an
Electronics Forum | Sun May 02 11:44:03 EDT 2010 | davef
J-STD-001 is your base requirement, but MIL and SPACE have stringent requirements for soldering gold plated terminals, e.g. this typical one: http://xweb.nrl.navy.mil/glast/CALDesign/CDE/CAL%20DPD%20Wire%20Cable%20Soldering%20and%20Staking%20Spec%20
Electronics Forum | Wed Aug 24 03:17:21 EDT 2011 | richieoreilly
Hi, Thanks for the info. The current process is a standard SMT hand soldering process. The time does not include cleaning, prepping and pre-tinning. Its just the time for the re-flow of one joint itself. We are waiting on some new tips to experimen
Electronics Forum | Tue Dec 31 10:17:12 EST 2019 | emeto
Let's stay away from the PCB and process for a while. This component is pre-tinned. What kind of solder? How is the component stored? I bet you that you can put just flux on the board and solder this part - have you tried? I think we should understan
