SMT Semi Auto Screen Printer for pcb size 1200 in smt LED production line Product introduction: 1.Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. 2.Printing scraper can rotate 45
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YONG/SPI KY8030 2XL MACHINE KY8030-2XL MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square, irregular polygon, circle)/volume/spacing (X, Y axis)/angle
Used SMT Equipment | SPI / Solder Paste Inspection
Solder paste thickness detector Measurement software: MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square Shape, irregular polygon, circle) / volume / spacin
Used SMT Equipment | AOI / Automated Optical Inspection
Hardware composition: Ring LEDs (R, G, B) Image resolution 20µm Fixed shape, fixed substrate Single-phase power supply 100 to 240VAC ±10% The weight is below 500kg Equipment dimensions: 700W×900D×1600H mm (height
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
Parts & Supplies | Pick and Place/Feeders
Equipment introduction: Fuji mounter AIMEX II: Fuji mounter AIMEX II is a multi-functional integrated mounter for various production forms from trial production to mass production. It has a large-capacity material station capable of carrying various
Parts & Supplies | Pick and Place/Feeders
Equipment introduction: Fuji mounter AIMEX II: Fuji mounter AIMEX II is a multi-functional integrated mounter for various production forms from trial production to mass production. It has a large-capacity material station capable of carrying various
