Full Site - : printing 0402 (Page 3 of 34)

You, too, can do 0402!

Technical Library | 2005-05-16 12:09:02.0

Low cost techniques for building prototype and low volume SMT printed circuit boards.

Articulation LLC

S.B.TECHNOLOGIES

Industry Directory | Manufacturer

S.B.TECHNOLOGIES provides Electronics Manufacturing Services with 0402 CHIP SMT Assembly,BGA, Thru-Hole PCB Assembly, Wave Soldering, Reflow Soldering, Mixed Technology Printed Circuit Board Assembly build to IPC-Workmanship Stand

HITACHI PXH-1 Screen Printer

HITACHI PXH-1 Screen Printer

New Equipment | Printing

With its compact size, high-speed and high precision, the machine achieves a high level of cost-performance. PXH-1 is a high-performance screen printer that enables high speed and high accuracy printing within a compact frame. The PXH-1 printer is

Hitachi High Technologies America, Inc.

An Investigation into the Use of Nano-Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios

Technical Library | 2017-09-28 16:36:33.0

These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge. This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.

FCT ASSEMBLY, INC.

Top Side Clamping

Top Side Clamping

Videos

High Value Stencil Screen Printing Solutions from JUKI. The PMAXII printers utilize a patented mathematical calculating algorithm to ensure the machine's high accuracy print alignment that easily achieves 01005 (0402 metric) printing. Vision

Southwest Systems Technology

The printer series GL and PMAXII provide more features than all other printers available in the market.

The printer series GL and PMAXII provide more features than all other printers available in the market.

Videos

The printer series GL and PMAXII provide more features than all other printers available in the market. Additionally, free software upgrades throughout the printer's lifetime are available. This proven quality product offers unequalled opportunities

Juki Automation Systems

JUKI GL Fully Automatic Screen Printer

JUKI GL Fully Automatic Screen Printer

New Equipment | Printing

High Value Stencil Screen Printing Solutions from JUKI. The GL printers utilize a patented mathematical calculating algorithm to ensure the machine’s high accuracy print alignment that easily achieves 01005 (0402 metric) printing. Vision and Opti

Juki Automation Systems

JUKI PMAXII Large Format Fully Automatic Screen Printer

JUKI PMAXII Large Format Fully Automatic Screen Printer

New Equipment | Printing

The PMAXII printers utilize a patented mathematical calculating algorithm to ensure the machine’s high accuracy print alignment that easily achieves 01005 (0402 metric) printing. Vision and Optics System The simultaneous up/down Optical Structure l

Juki Automation Systems

C.E. ANTS Company Limited

Industry Directory | Consultant / Service Provider / Manufacturer

Bangkok company providing medium volume lead-free SMT printed circuit board assembly (PCBA) and box build service. We provide full turnkey service and/or material consignment. Sample boards are : electronics ballast, LED driver and motor driver.

Board Design and Assembly Process Evaluation for 0201 Components on PCBs

Technical Library | 2023-05-02 19:06:43.0

As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.

Flextronics International


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