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Used SMT Equipment | SPI / Solder Paste Inspection
KOH YONG/SPI KY8030-3 MACHINE The Industry’s Fastest True 3D Solder Paste Inspection System The KY8030-3 is back, faster than ever using Koh Young’s 3D dual-inspection technology to eliminate critical shadow problems
Used SMT Equipment | SPI / Solder Paste Inspection
KY8030-2 The industry's Most Popular True 3D Solder Paste Inspection Solution . Best-in-dass measurement accuracy and inspection reliability -Solves shadow problems by utilizing 2-way projection - Accurate inspection data with real-time P
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Used SMT Equipment | Labeling Systems
1. This product is made of imported stainless steel materials from Japan and is enclosed with the original Nano insulation materials from the United States. 2. This product has an extremely long service life. The general time is three to five years
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
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