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Electronics Forum | Wed Feb 28 19:44:50 EST 2001 | pzohbon
I am having problems with voids in our soldering process. I believe it to be the fact that we use a no clean flux without control on how the boards are handled (gloves, procedures, etc.) Does anyone have suggestions on the appropriate place to start?
Electronics Forum | Tue Mar 06 03:29:05 EST 2001 | daled
Hello I am looking for any data that confirms the long term reliabilty of no clean paste as opposed to water soluable. Does anyone have any past experiences of problems when changing over from water soluable to no clean in the SMT prcocess?? Thanks i
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2011-01-12 17:40:04.0
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Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2017-11-08 23:22:04.0
Due to the ongoing trend towards miniaturization of power components, the need for increased thermal conductivity of solder joints in SMT processes gains more and more importance. Therefore, the role of void free solder joints in power electronics becomes more central. Voids developed during soldering reduce the actual thermal transfer and can cause thermal damage of the power components up to their failure. For this reason, the company has developed a new technique to minimize the formation of these voids during the soldering process.
Localization of high-power lasers accelerates, and development bottlenecks need to be broken Superpower lasers are characterized by small size, light weight, high electro-optic conversion efficiency, stable performance, high reliability and lon
At present, the low-power laser and the medium-power laser are gradually being localized, while the superpower lasers are just beginning to be localized and is accelerating. How to improve the reliability of superpower lasers welding is an urgent tec
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Career Center | Fort Mill, South Carolina USA | Engineering,Maintenance,Research and Development
Have serviced AMF pinspotters both mechanical and electrical sides; included repair of chassis pc boards to component level. 20 years in this field. Have worked in PCB manufacture with old style board populators and Panasert robots Worked in H
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/problems-about-mosfet_topic3089_post12316.html
: 4 Post Options Post Reply Quote ROSELJR Report Post Thanks(0) Quote Reply Topic: Problems about MOSFET Posted: 21 Mar 2022 at 2:54am MOSFET is the device with the smallest power capacity of all power electronic devices right
Heller Industries Inc. | https://hellerindustries.com/voids/
Circuit Board Voids Home » Circuit Board Voids Re-printed in partnership with ITM Circuit Board Voids Circuit Board Voids are cavities or air pockets inside the solder joint formed by gases that are released during reflow or by flux residues that fail to escape from the solder
