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Method for Automated Nondestructive Analysis of Flip Chip Underfill

Organic Flip Chip Packages for Use in Military and Aerospace Applications

Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications

A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints.

Using Hansen Space to Optimize Solvent Based Cleaning Processes for Manufacturing Electronic Assemblies

Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure

DOE for Process Validation Involving Numerous Assembly Materials and Test Methods

Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications

Surface Insulation Resistance Testing. Results of Independent Testing for Best Inc. BGA Stencil Repair Rework Samples Solder Paste Reattachment

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