Industry News | 2003-04-21 09:53:12.0
Michael T. O'Neill and Peter J. Simone
Industry News | 2019-01-17 20:36:59.0
MIRTEC, ‘The Global Leader in Inspection Technology’, is pleased to announce the appointment of Kirby & Demarest as its manufacturers’ representative. Kirby & Demarest will provide sales and support for MIRTEC’s award-winning inspection systems in Oregon, Washington, Idaho, Montana and the Province of British Columbia. The rep firm provides high technology companies an array of products utilized in the design, manufacturer and test of circuit board assemblies, hybrid circuits, and semiconductors.
Industry News | 2021-10-04 13:48:55.0
MIRTEC is pleased to announce their plans to exhibit at the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021, at the Minneapolis Convention Center in Minneapolis, MN. The MIRTEC team is looking forward to meeting with attendees at booth #3500 for a detailed demonstration of its MV-6Z OMNI 3D In-Line AOI system.
Industry News | 2021-12-21 14:45:26.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1122 at the 2022 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place January 25-27, 2022, at the San Diego Convention Center.
Industry News | 2003-05-09 08:35:07.0
Bringing the board experience more in line with its business objectives
Industry News | 2003-05-22 08:36:27.0
Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability
Industry News | 2003-06-09 09:16:38.0
The adoption of AWR EDA software supports REMEC�s continuous efforts to manage the substantial challenges of today�s wireless design technology.
Industry News | 2018-08-21 20:05:28.0
MIRTEC, ‘The Global Leader in Inspection Technology’, is pleased to announce it has entered into a Technical Collaboration Agreement with YXLON, a company of the Comet Group. This collaboration allows both organizations to explore and expand upon synergistic applications within the SMT Electronics Manufacturing Industry.
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2003-06-20 08:54:22.0
Service Pack 1 for P-CAD 2002 released today
