Industry News | 2023-10-09 09:50:55.0
SMTXtra USA Inc. is pleased to announce that it appointed Tony Longo as Director of Sales. With a career spanning more than 25 years in the SMT electronics industry, Mr. Longo brings a wealth of experience in sales and technology strategies, product design, and effective leadership.
Industry News | 2011-12-02 18:36:19.0
Manufacturing and quality engineers looking for solutions to process challenges will find answers at the NPL Process Defect Database Clinic at IPC APEX EXPO®, February 28-March 1, 2012, at the San Diego Convention Center. Organized by IPC and the National Physical Laboratory (NPL), the free clinic will be held in the exhibit hall to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.
Events Calendar | Thu Dec 05 00:00:00 EST 2019 - Thu Dec 05 00:00:00 EST 2019 | ,
Webinar: Update on New IPC-1752B Supply Chain Standard — Preparing for Submissions to the ECHA SCIP Database
Industry News | 2010-11-04 22:57:30.0
The SMTA is pleased to announce plans are now finalized for the 2011 Pan Pac Symposium and Tabletop Exhibition.
Industry News | 2010-12-01 13:54:27.0
The SMTA is pleased to announce plans are now finalized for the 2011 Pan Pac Symposium and Tabletop Exhibition.
Industry News | 2021-02-08 15:08:49.0
IPC announces the release of IPC-2551, International Standard for Digital Twins. Thisfirst international standard is comprised of digital twin product, manufacturing, and lifecycle frameworks. Using this standard, any manufacturer, design organization or solution provider can initiate application interoperability to create smart value chains.
Industry News | 2011-05-17 11:04:30.0
High Yield BGA Reballing Simplified
Industry News | 2015-04-07 15:57:40.0
SMTA and Chip Scale Review magazine are pleased to announce plans for the 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.
Events Calendar | Thu Mar 14 00:00:00 EDT 2024 - Thu Mar 14 00:00:00 EDT 2024 | Monterrey,
Monterrey Expo & Tech Forum
Events Calendar | Thu Sep 07 00:00:00 EDT 2023 - Thu Sep 07 00:00:00 EDT 2023 | Chihuahua, Mexico
Chihuahua Expo & Tech Forum
