Industry News | 2010-11-30 13:30:04.0
Ironwood Electronics' new package converter - PC-BGA256B/BGA256E-B-01 allow previous product version to be used in the new system boards for test/validation until the new BGA device is released from the foundry or vice versa. These package converters can be soldered directly onto the SMT pads of development boards using standard solder methods.
Industry News | 2011-01-25 14:49:29.0
New Reflow Oven Introduced by APS Novastar - The ERO-500 Reflow Soldering System, A Five Zone, Cost-Effective Reflow Solution for Small to Medium Volume Lead-Free SMT Production and Prototyping.
Industry Directory | Manufacturer
Eastech Group was established in 2006. It is a professional research and development, production and sales of high precision multilayer circuit board manufacturers(National High-tech Enterprise).
Technical Library | 2012-12-20 14:36:09.0
The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more. First Published at SMTA's International Conference on Soldering and Reliability in Toronto, May 2011
Industry News | 2018-10-18 09:54:05.0
The Value of Outsourcing PCB Assembly Manufacturing
Industry News | 2017-05-09 15:27:09.0
Digicom Electronics will present methods for improving product quality and integrity during the electronics assembly process at the Design-2-Part Show, being held in the Santa Clara Convention Center, Santa Clara, CA, on May 24 and 25, 2017, in booth 331. Improvement methods include Digicom's proprietary Diamond Track Nitrogen and Diamond Track Cleaning services to reduce or eliminate defects in printed circuit boards, especially for mission critical products such as those used in the medical, military and aerospace, industrial, and RF wireless industries.
Industry News | 2015-06-12 09:23:50.0
Kenosha, WI — June 11, 2015 — A leader in the field of PCB Handling Equipment and Robotic Soldering Systems PROMATION Inc. announced it has just completed its second line installation for a major medical device manufacturer.
Industry Directory | Consultant / Service Provider / Manufacturer / Standards Setting / Certification
Creative Electron is the largest US manufacturer of x-ray inspection systems for electronics. We proudly design and manufacture the award winning TruView X-Ray family of products.
EAO, the Expert for Human Machine Interfaces, is now offering a switch with multicoloured “Halo” illumination for creating highly flexible displays. Designed for use with SMD LEDs, up to 10 different colours can be combined in one switch: eight withi
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
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