Industry News | 2017-08-15 21:08:19.0
KIC announces plans to exhibit in Booth #123 at SMTA International, scheduled to take place September 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The KIC team will showcase the KIC ecosystem comprised of the brand new SPS Smart Profiler, RPI automatic profiling system, and the new Vantage with networked real-time dashboard.
Industry News | 2017-08-16 17:48:42.0
KIC today announced a new business relationship with ViTrox Corporation. ViTrox, the leader in visual inspection and production line dashboard systems, and KIC, the smart oven technology company, have established this new business relationship to meet the needs of the evolving electronics industry. The need for real-time data and insight from production machines and inspection systems is growing rapidly as the electronic manufacturing industry converts factories into smart production facilities. While real-time dashboard and traceability systems have been around for some time, the ‘black box’ reflow process has been a glaring omission in such systems. The ViTrox V-One system will connect to KIC’s automatic profiling and thermal monitoring systems to offer a full line solution.
Industry News | 2023-04-11 09:54:13.0
KIC will exhibit in Hall 4, Booth #126 at SMTconnect, scheduled to take May 9-11, 2023, in Nuremburg, German. KIC provides the most accurate Heat to Data™ solutions including its award-winning support with onsite service and application knowledge from the thermal process experts.
Industry News | 2012-01-10 19:58:20.0
KIC announces the release of the Reflow Process Index (RPI), designed to help electronics manufacturers receive maximum quality and throughput from their reflow ovens.
Industry News | 2010-03-24 13:42:48.0
San Diego - March 2010 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, will share the latest science and products for reliable nondestructive methods of profiling in booth #1549 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV.
Industry News | 2016-10-13 15:46:28.0
KIC today announced plans to exhibit at the New England Expo & Tech Forum, scheduled to take place Thursday, November 3, 2016 at the DCU Center in Worcester, MA. MB (Marybeth) Allen will present “Optimization of the Reflow Profile to Minimize Voiding.”
Industry News | 2022-01-10 16:35:13.0
KIC is well-known as the market and innovation leader in solutions for reflow and wave soldering process management. Going into its 45th year as the pioneer in thermal process monitoring, KIC looks forward to the next decade and further innovations.
Industry News | 2017-07-12 17:08:26.0
KIC announces that its president, Bjorn Dahle, celebrated his 20-year milestone with the company. Though he joined KIC in 1996 and assumed his role as the company’s President in 2000, Dahle believes he is just getting started. KIC’s thermal profiling products have become omnipresent in the EMS industry with the well-known KIC logo appearing on reflow ovens in thousands of factories.
Industry News | 2009-01-30 16:42:42.0
San Diego � January 2009 � KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that it will feature KIC's new RPI, Reflow Process Inspection. KIC also will be showing the KIC Explorer Dual model that may be used as a datalogger or as a real-time profiler using radio frequency technology. KIC will be in representative Mectronics Marketing Services' booth, located in Hall #18 in booth #406, at the Componex/Nepcon India 2009, scheduled to take place February 24-26, 2009 in New Delhi.
Industry News | 2019-07-22 18:08:34.0
KIC announced that MB Allen, Manager for KIC’s Applications & Sales, will present at the SMTA Capital Expo & Tech Forum, scheduled to take place Thursday, Aug. 22, 2019 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD. Allen will present “Optimization of the Reflow Profile to Minimize Voiding.”
