New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
New Equipment | Solder Materials
Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,
Electronics Forum | Sun Nov 20 01:27:21 EST 2005 | C. Kolokoy
Try an experiment where you profile the assembly with 3 consecutive boards in the oven spaced just 1" apart versus just 6" apart and then 12" apart. You figure most ovens have about 12 - 16" heating zones, so for your typical 8"x8" PCB, you'd have w
Electronics Forum | Wed Nov 21 12:29:52 EST 2001 | mparker
Now that we know where you've been and what you wish to accomplish next, I can still give you some suggestions. 1. Get IPC-7912. Use it to evaluate your CM's. Especially if you have multiple contractors supplying like products. You will quickly see
Industry News | 2011-01-20 13:45:14.0
IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.
Industry News | 2016-05-31 21:21:26.0
IBL Technologies, LLC announces that Firstronic LLC (www.firstronic.com), headquartered in Grand Rapids, MI, has installed its third CX Model Inline Vapor Phase Reflow system.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 97, (#ts#)) SMT Express, Volume 4, Issue No. 1 - from SMTnet.com Volume 4, Issue No. 1 Thursday, January 17, 2002 Featured
| http://etasmt.com/cc?ID=te_news_industry,24568&url=_print
. By heating method different, SMT Reflow oven called hot air convection reflow oven or infrared Reflow oven, Some reflow oven is Dual lane
Lewis & Clark | http://www.lewis-clark.com/product-tag/heller-1707/
: 14 Temperature controlled 350 Degree Balanced Flow “Lead Free” Heating Zones KIC & ECD Profiling and Storage software Forced Convection Mesh Belt and Edge Hold Conveyor w/ Power Adjust Front Railed Fixed Automatic Lubrication System for Edge Hold Conveyor SMEMA Interface Battery Back Up 208v / 240v 100 AMPS Condition: Complete & Operational
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