Industry News | 2003-05-21 08:51:07.0
DEK has added a new section to its website that consolidates information on the benefits of using PumpPrint process technology for high-speed adhesive deposition.
New Equipment | Solder Materials
All AMTECH solder pastes conform to ANSI/J-STD-006 and are available for immediate delivery in jars, cartridges, syringes and ProFlow Cassettes. They are also available in FreshMix™ kits. Our customer representatives are ready to discuss your SMT req
Parts & Supplies | Screen Printers
Manufacturer: DEK Type: INF.01 (Infinity) Vintage: 2004 Serial number: 283904 SW: 07SP11 (Build 985B02, 08.12.2006) Equipment on printer • Standard print head(not Pro-Flow) • Gold camera • Blue stencilcleaner unit • Shor
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2010-04-14 20:57:38.0
From the recently re-energized Horizon platform, through to comprehensive print process control tools and next-generation stencil technologies, the DEK display at Nepcon Shanghai will treat booth visitors to the ultimate in print productivity. Being held from 20th – 22nd April at the Everbright Convention & Exhibition Centre, the twentieth Nepcon Shanghai event will see DEK demonstrate a selection of advanced products and processes from booth 1E08.
With its modular design, the latest generation of our powerful screen printers is customizable for any customer-specific or application-specific requirements. Clamping systems, conveyors, toolings, paste management, verification, the new version of t
New Equipment | Solder Materials
High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing
Advanced semiconductor packaging and high precision SMT assembly convergence. Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced techno
New Equipment | Solder Materials
Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,
Industry News | 2008-04-29 22:59:31.0
Celebrating 40 years in business, mass imaging specialist DEK is using this significant milestone to reaffirm its longstanding commitment to providing customers with innovative solutions.
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