Industry Directory | Manufacturer
-세계 최고 품질의 대류열풍방식으로 새로운 표준을 선도하는 HELLER Reflow Oven -10년 연속 World Wide Market Share 1위와 2014 SERVICE EXCELLENCE AWARDS 수상
Industry Directory | Manufacturer
United Adhesives makes special adhesives, coatings, potting gels, sealants, various conductive adhesives, and optical adhesives for applications in electronics, semiconductors, and telecommunications.
New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
Electronics Forum | Tue Apr 02 11:21:46 EST 2002 | BTaylor
davef I assume this question is for my reply and me. We used a dexter\hysol underfill and a Camalot 5700 to dispense.Single line technique next to a small IC with 14 bumps around the perimeter.The conformal coating was applied with a small brush aro
Electronics Forum | Fri Jun 09 01:27:07 EDT 2006 | Scott
Thanks for the info. I've been able to arrange some training with the local branch of Samsung, who are getting engineers from Korea to come over to teach us. It sounds like an exercise in wasted time and manpower to me, but that's what you get I supp
Used SMT Equipment | SMD Placement Machines
Underfill machine Asymtek X1020 No head(dj-9000) price: exus$10,000 SAEBYUK_ENG #1209, Hansoltechnopark-3cha 1597-1,KWANYANG-DONG, Dongan-Gu, Anyang-City, Kyung Ki-Do, KOREA TEL:82-31-381-1608 FAX : 82-31-381-1609 H.P :010-
Used SMT Equipment | SMD Placement Machines
Underfill machine Asymtek X1020 No head(dj-9000) price: exus$10,000 SAEBYUK_ENG #1209, Hansoltechnopark-3cha 1597-1,KWANYANG-DONG, Dongan-Gu, Anyang-City, Kyung Ki-Do, KOREA TEL:82-31-381-1608 FAX : 82-31-381-1609 H.P :0
Industry News | 2013-01-28 02:11:23.0
Offers precise, repeatable dispensing of phosphor for coating and encapsulation
Industry News | 2019-09-11 14:47:58.0
The IPC Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing for board fabrication, assembly and post-assembly protection. The three-day forum, to be held November 5-7 in Bloomington, Minn. will be co-located with a Pb-free Electronics Risk Management (PERM) Council meeting.
Technical Library | 2023-08-16 18:42:25.0
In one of our medical applications projects, the customer wanted to dispense a mask to protect gold leads and an underfill on a silicon substrate with a clear test die. The substrates were Dymax X-499-91-C for Masking and Epoxibond-106M-1 for Underfill Dispensing
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Hawthorne, California USA | Engineering
SMT PROCESS ENGINEER (STARLINK) Hawthorne, CA, United States SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing
Career Center | Savannah, Georgia USA | Engineering,Human Resources,Maintenance,Management,Production,Quality Control,Research and Development,Technical Support
I’d like to give you a brief overview of my skills and experience. I am confident that I could bring value to the SMTnet as your Safety Professional. Here’s how my qualifications meet your requirements: • Military (E-7) Manager with experience as
GPD Global | https://www.gpd-global.com/co_website/soldermask-volumetric.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
| https://www.feedersupplier.com/sale-13118794-smt-pick-and-place-machine-and-spare-parts-samsung-cp40-cp45-8x2mm-feeder-pick-and-place-machine-fee.html
: Busan, South Korea Brand Name: Samsung Model Number: cp45 Minimum Order Quantity: 1.0 Piece/Pieces Price: Negotiation Packaging Details
-세계 최고 품질의 대류열풍방식으로 새로운 표준을 선도하는 HELLER Reflow Oven -10년 연속 World Wide Market Share 1위와 2014 SERVICE EXCELLENCE AWARDS 수상
459-1 Jangji-Dong, Kwangju-Si
Kyungki-Do, 13 South Korea
Phone: +82-31-769-0808
