Full Site - : ptfe fine powder (Page 10 of 12)

Re: Solder FINES vs. Solder Balls

Electronics Forum | Thu Apr 15 12:58:59 EDT 1999 | Chrys Shea

| | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | I consider "fines" individual unmelted metal spheres that are foun

soldering and bonding on gold PCB's

Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef

For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s

Void on soldering

Electronics Forum | Tue Jul 31 17:11:28 EDT 2007 | rpadilla

Is the via hole not supposed to be there, or is this by design? If you are trying to fill the via hole with solder and not have voiding issues, I suggest using a type 4 solder powder mesh size. Reason being, anytime you go beyond Type 4 mesh, to so

Re: Solder FINES vs. Solder Balls

Electronics Forum | Sat Apr 17 12:00:12 EDT 1999 | John W

| | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | I consider "fines" individual unmelted metal spheres t

Re: Solder FINES vs. Solder Balls

Electronics Forum | Sun Apr 18 00:26:29 EDT 1999 | Vic Lau

| | | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | | | I consider "fines" individual unmelted metal sph

Dross Eliminator

Electronics Forum | Mon Aug 21 10:58:34 EDT 2006 | davef

Pulsar Solder Saver: "The Solder Saver is a unique, handheld tool that scoops dross directly from the surface of the solder wave pot. The dross oxides are instantly separated from the solder using a unique high-speed rotary process system. The newly

Re: Solder FINES vs. Solder Balls

Electronics Forum | Thu Apr 15 15:07:20 EDT 1999 | Mark Charlton

| | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | I consider "fines" individual unmelted metal spheres that ar

Re: Squeegee Speed

Electronics Forum | Tue Feb 23 09:51:35 EST 1999 | Steve Schrader

| Hey all- | | My question is this: My stencil printer operator has said that he has to | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 | paste with

Re: Strange problem with my dispenser

Electronics Forum | Wed Aug 11 10:21:03 EDT 1999 | Brian

| Has anyone ever heard of this? I have a Camalot System 5000 and we were in a pinch to produce some prototype boards. We needed Sn62Pb36Ag2-no clean in a dispensing mesh. All I could get my hands on was some Interflux paste in a jar. The formulation

Re: Strange problem with my dispenser

Electronics Forum | Wed Aug 11 11:54:50 EDT 1999 | Dave F

| | Has anyone ever heard of this? I have a Camalot System 5000 and we were in a pinch to produce some prototype boards. We needed Sn62Pb36Ag2-no clean in a dispensing mesh. All I could get my hands on was some Interflux paste in a jar. The formulati


ptfe fine powder searches for Companies, Equipment, Machines, Suppliers & Information