Electronics Forum | Wed Jun 22 01:57:28 EDT 2016 | sachinverma
we face the problem to last month dry solder issue.when we found PCB is dry. (PTH not fill not properly)then we change the parameter like flux Tank pressure increase 130 to 250. after these activity PCB is ok no dry solder found......but problem is o
Electronics Forum | Mon Oct 15 14:36:03 EDT 2018 | davef
The methods of verifying PTH hole-fill. 1 Visual inspection 2 x-ray inspection works very well for inspecting such a connector for voiding and hole fill. View the connector off-vertical, at between 30 and 45 degrees. As always, the solder connect
Electronics Forum | Thu Aug 05 08:04:32 EDT 1999 | Peter Barton
| Hi , | | Could DIP package ( PTH) run through IR Reflow instead of wave soldering? | | Will there be any reliability impact on this package. | | Thanks | | Jack | | Jack, The dip component package material and the packaging process is the sa
Electronics Forum | Tue Dec 17 11:01:24 EST 2002 | Tim Marc
Hello all, One of our PCB manufacturers coated a through hole connecters vias with solder mask. The only IPC references that comes close to describing this problem is 2.9.2 Registration to holes, and subsequent specification 6.3.1 PTH � Vertical fil
Electronics Forum | Mon Feb 23 23:50:18 EST 1998 | mike
| Does anyone have any experience with via in pad for | BGAs using conventional thru hole technology? | Steve Joy Steve, I had a customer who had designed a board to use a BGA socket. Well the socket did not work out so we then placed the bga dire
Electronics Forum | Sat Aug 18 11:23:10 EDT 2007 | Learn From U
Hi All, Via X-rays, we found solder voids appear on PTH location, especially on Dimm connectors area. We think this should be related to PCB issue as we found solder unable to fill up the PTH hole during bare board testing at wave soldering machi
Electronics Forum | Wed Apr 06 22:59:02 EDT 2005 | smt_rookie
It is the solder ball that's usually encountered in a reflow process. It's just that, the paste did not wet well along the connector pins. Before reflow, the paste is actually at the tip of the connector, and stayed there and never went up to fill th
Electronics Forum | Wed Aug 10 16:37:35 EDT 2011 | davef
Yes, there are ways to machine process boards like this. The devil is in the detail. In no particular order, your choices are: Process flow #1: * Print chipbonder on the surface mount side for SMT parts * Mount SMT components * Cure adhesive, if r
Electronics Forum | Thu Dec 29 22:19:36 EST 2005 | Joseph
We have tested SN100C for LF wave soldering process since August'05 and currently start production for a month ago. Initially we use SAC305, but due to the shrinkage cavities (micro-crack) we changeover to SN100C. In summary, SN100C did perform well
Electronics Forum | Tue Feb 24 09:52:14 EST 2004 | davef
First, two points about hole / barrel fill are: * A filled hole is an excellent indicator of the optimum process and optimum quality PCB. * The study that showed that holes need not be filled was paid for by the US Army and performed by Lockheed in
