Industry Directory | Manufacturer
Manufacturer of Real-time Automated Xray Inspection. Focus on SMT solder joint inspection of hidden joints ie, BGAs and PTH Barrel Fill per IPC-610. Clients include leading manufacturers in the electronics/automotive Industries.
Industry Directory | Consultant / Service Provider
Consulting firm established to promote career opportunities in the electronic manufacturing industry. We specialize in the printed circuit board assembly industry servicing the computer, telecommunication, medical, instrumentation and process controls equipment. Our customers use the state of the art equipment such as fuji, panasonic, universal pick & place equip., chip shooters, reflow
New Equipment | Education/Training
IPC J-STD 001 REV F Requirements for Soldered Electrical and Electronic Assemblies. The IPC J-STD-001F standard is the industry-consensus document with respect to the assembly of PCBs and electronic assemblies. Released August 2014. IPC J-STD-001
New Equipment | Soldering - Other
IPC J-STD 001 REV G Requirements for Soldered Electrical and Electronic Assemblies. The IPC J-STD-001F standard is the industry-consensus document with respect to the assembly of PCBs and electronic assemblies. Released October 2017. IPC J-ST
Electronics Forum | Wed Dec 19 09:24:21 EST 2012 | swag
Many times we manually add flux from the top side for good fill.
Electronics Forum | Wed Dec 19 09:41:14 EST 2012 | dyoungquist
What is your solder pot temperature? We found that on a 0.093" multilayer board increasing the temp of the lead free solder from 300C to 315C helped with the barrel fill.
Industry News | 2017-05-15 16:35:00.0
SMTA China announces that it presented awards for seven papers and two exhibits at the SMTA China East Conference 2017 Award Presentation Ceremony, held on Tuesday, April 25, 2017 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2019-03-03 18:51:58.0
The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor this Chapter Tutorial Program on March 28 featuring presentations by Yaad Eliya and Jim Barry of PCB Technologies.
Technical Library | 2020-07-22 19:39:05.0
The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predicting reliability must ensure that the failure mechanism is demonstrated as a wear-out failure mode because a plating wrap failure is unpredictable. The purpose of this study was to quantify the effects of various copper wrap plating thicknesses through IST testing followed by micro sectioning to determine the failure mechanism and identify the minimum copper wrap thickness required for a reliable PWB. Minimum copper wrap plating thickness has become an even a bigger concern since designers started designing HDI products with buried vias, microvias and through filled vias all in one design. PWBs go through multiple plating cycles requiring planarization after each plating cycle to keep the surface copper to a manageable thickness for etching. The companies started a project to study the relationship between Copper wrap plating thickness and via reliability. The project had two phases. This paper will present findings from both Phase 1 and Phase 2.
Teresa Rowe, IPC director of assembly standards, highlights several revisions to IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610F, Acceptability of Electronic Assemblies. The documents have been updated to
This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials. For More Information On IPC J-STD-001 Training Visit Our Website: IPC J-STD-001 CIT Cert
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
This cell contains DSP_TRAILER.CFM. This is a layout/formatting test. Eventually, useful content will fill this area.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/explorer-one
. Inspecting boards from every side is important to catch head in pillow defects, observe component cracking and to clearly see PTH solder fill level
Lewis & Clark | https://www.lewis-clark.com/product-tag/inline-washer/
” Exit Conveyor Extension Wash Dual Hurricane Jet with 15Hp Pump Rinse Dual Hurricane Jet with 15Hp Pump Torrid Zone Dryer Split Drain Demisting Filter Separate Fill Lines for Wash
