Electronics Forum | Thu Jan 04 15:27:23 EST 2007 | patrickbruneel
Here it is Steve Here's a (427 page) EPA report on Solders in Electronics: A Life-Cycle Assessment http://www.epa.gov/opptintr/dfe/pubs/solder/lca/lfs-lca-final.pdf If you look at page ES-16/table ES-4 and ES-5 it appears that SAC alloys have a hig
Electronics Forum | Wed Jul 31 17:36:32 EDT 2002 | davef
Basically you need to do two things 1 Look at and print drawings you get. 2 Keep track of where those drawing are stored. LOOKING AT AND PRINTING DRAWINGS YOU GET. Use: * Same software that your customer used to create the drawing. [Oh, lots of cu
Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125