Industry Directory | Manufacturer / Other
Simplimatic Automation designs and manufacturers complete material handling systems for circuit board, Auer boat, JEDEC tray processes, including product marking. Full line of pallet, part, and puck handling equipment. Global on-site support.
Simplimatic designs and builds material handling equipment for PCB, Auer boat, and JEDEC tray manufacturing processes, including product marking. Products for part, puck, and pallet handling also available. Standard table top conveyors and robotic
Simplimatic designs and builds material handling equipment for PCB, Auer boat, and JEDEC tray manufacturing processes, including product marking. Products for part, puck, and pallet handling also available. Standard table top conveyors and robotic
Electronics Forum | Thu Mar 20 08:46:21 EDT 2008 | mefloump
You can also try Omni-Tronics, Inc. (763) 425-2675. This is who we purchase parts from for our Paste Puck.
Electronics Forum | Thu Mar 27 05:49:33 EDT 2008 | ianlg
Hi If you still want to gp down the Paste Puck route then Reprint Limited has an ex Demo Paste Pucj system available available. http://www.reprintservices.co.uk/Screen_Printer_Availability_Listing.html
Industry News | 2012-01-26 22:37:08.0
KIC will hold a ‘Meet Dave Day’ in Booth #2428 at the upcoming IPC APEX Expo. Dave Nason, KIC’s R&D/Production Operations Manager, will be in the KIC booth on Tuesday February 28, 2012 from 11 a.m.-12:30 p.m. and 1:30-2:30 p.m.
Industry News | 2009-06-05 07:47:18.0
Paul Nickelsberg, spoke at MDG Forum: Why medical devices fail and what you need to do to prevent it from happening
Technical Library | 2021-09-21 20:20:22.0
The electronics industry has been using the epoxy puck for the processing of the vast majority of electronics microsections since the 1970s. Minimal advancements have been seen in the methods used for precision micro-sections of PCBs, PCBAs, and device packages. This paper will discuss different techniques and approaches in performing precision and analytical micro-sections, which fuse the techniques and materials common in preparation of silicon wafers and bulk materials. These techniques have not only been found to produce excellent optical results, but transfer effectively to SEM for high magnification inspection and further analysis with minimal post-lapping preparation needed. Additionally, processing time is reduced primarily due to a significant reduction of bulk material removal earlier in the preparation, therefore needing less removal at later lapping steps compared to traditional sectioning methods. Additional techniques are introduced that mitigate some classic challenges experienced by technicians over the decades.
we have many universal gold plus feeders to sell . www.smt-store.com
we have many hitachi equipment and hitachi feeders to sell . if you want to know more , please contact us tina@smtfeeders.cn
