Full Site - : puddles of conformal coating on pcb (Page 9 of 12)

Use of Wood on PCB Assembly Production floor ??

Electronics Forum | Thu Mar 09 10:19:24 EST 2000 | Ashok Dhawan

I have a question (s) on ESD- all related to use of wood in a typical PCB Assembly line: 1. How a wooden mini stool if used for holding tote box ( card board with static protecive coat, black color) can affect static sensitive devices inside the tot

Use of Wood on PCB Assembly Production floor ??

Electronics Forum | Thu Mar 09 10:19:24 EST 2000 | Ashok Dhawan

I have a question (s) on ESD- all related to use of wood in a typical PCB Assembly line: 1. How a wooden mini stool if used for holding tote box ( card board with static protecive coat, black color) can affect static sensitive devices inside the tot

Re: Use of Wood on PCB Assembly Production floor ??

Electronics Forum | Thu Mar 09 16:56:19 EST 2000 | Dave F

Ashok: If I was to count, I'd guess there was more than 4 subquestions. Hey, but who's countin' anyway? I have answer (s) "on ESD all related to use of wood in a typical PCB Assembly line:" Before pushing-on, it is only "a typical PCB Assembly li

Re: Use of Wood on PCB Assembly Production floor ??

Electronics Forum | Thu Mar 09 16:56:19 EST 2000 | Dave F

Ashok: If I was to count, I'd guess there was more than 4 subquestions. Hey, but who's countin' anyway? I have answer (s) "on ESD all related to use of wood in a typical PCB Assembly line:" Before pushing-on, it is only "a typical PCB Assembly li

Re: Solder Balls on end of long pins

Electronics Forum | Thu Sep 09 10:34:02 EDT 1999 | John Thorup

| I am wave soldering a single sided through hole PCB array with (6) .040" round diameter pins that sit .5" off the PCB, and .080" apart. The problem being experienced is that solderballs are appearing on the end of the pins. I have tried decreasin

adhesive on pads

Electronics Forum | Mon Apr 01 20:10:24 EST 2002 | davef

Oh. [Howabout if I smack you?] If ahma connectin� wif whut yer sayin�, you: * Don�t like the appearance of the glue slobberin� out from under the component even though there is no apparent glue on solderable surfaces. * Concerned about the hydrosco


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