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Nordson DAGE to Bring Solutions for Live Imaging and Demanding Applications to SMT/Hybrid/Packaging

Industry News | 2013-03-20 10:54:36.0

Nordson DAGE, announces it will exhibit in Booth # 7-224 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

Nordson DAGE

MEC Midwest

Industry Directory | Manufacturer

Member of MEC Companies specializing in quality contract electronic assembly and design innovation

USB Tweezers

USB Tweezers

New Equipment | Test Equipment - Bond Testers

Many bond strength tests require a means to grip the part so that the strength of its bond can be tested. In many of these applications the geometry and force of the grip must be precisely controlled to ensure sufficient load can be applied to the bo

XYZTEC bv

PTS 310 Frequency Synthesizer

PTS 310 Frequency Synthesizer

New Equipment | Test Equipment

PTS 310 Frequency Synthesizer Items were pulled from a working Lab Environment, no further testing has been done. Features     0.1 MHz to 310 MHz     new standard in performance/price, with choice of spurious suppression     DDS standard wi

Recon Test Equipment Inc.

PTS D310 DUAL CHANNEL FREQUENCY SYNTHESIZER

PTS D310 DUAL CHANNEL FREQUENCY SYNTHESIZER

New Equipment | Test Equipment

PTS D310 Dual Channel Frequency Synthesizer Items were pulled from a working Lab Environment, no further testing has been done. Features     two fully independent channels,     each covering 0.1-310 MHz     +3 to +13 dBm output     low pha

Recon Test Equipment Inc.

Associated Research 403AI A.C. Junior Hypot.

Associated Research 403AI A.C. Junior Hypot.

New Equipment | Test Equipment

Items were pulled from a working Lab Environment, no further testing has been done. Associated Research 403AI A.C. Junior Hypot.   http://www.ebay.com/itm/Associated-Research-403AI-A-C-Junior-Hypot-/161077717342?pt=LH_DefaultDomain_0&hash=item2

Recon Test Equipment Inc.

Hesse Mechatronics Launches Heavy Wire and Ribbon Bonding Services for Early Stage Product Development

Industry News | 2013-05-06 18:13:00.0

Hesse Mechatronics will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder at the company’s west coast demonstration and applications lab, located at long-time company manufacturer's representative Chalman Technologies in Anaheim, California.

Hesse Mechatronics

Nordson DAGE Accepts a 2014 NPI Award for Camera Assist Automatic Bondtesting at APEX Advanced technology guarantees accuracy and repeatability

Industry News | 2014-03-26 08:17:39.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it has been awarded a 2014 NPI (New Product Introduction) Award in the category of Test and Inspection – Functional Test for its Camera Assist Automatic Bondtesting.

Nordson DAGE

Nordson DAGE to Launch New 4800 Wafer Level Bondtester at SEMICON West

Industry News | 2015-06-11 16:18:49.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit in Booth #5744 at SEMICON West 2015, scheduled to take place July 14-16, 2015 at the Moscone Center in San Francisco. Nordson DAGE will present the 4800 wafer level Bondtester for the first time in North America.

Nordson DAGE

Nordson DAGE Accepts SMT China Vision Award for Camera Assist Automatic Bondtesting

Industry News | 2015-04-21 15:58:48.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), is pleased to announce that it was awarded a 2015 SMT China Vision Award in the category of Inspection & Testing-Functional Testing for its Camera Assist Automatic Bondtesting. The award was presented to the company during an April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.

Nordson DAGE


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