Parts & Supplies | SMT Equipment
SMT Cleanroom wiper ,the details are as below: SMT stencil clean: Roll improve the working efficiency, control the waste material actively, save cost. We can made products as per the customer’s detail specification. Cleanroom Cloth: Made of 100%
Parts & Supplies | SMT Equipment
SMT Cleanroom wiper ,the details are as below: SMT stencil clean: Roll improve the working efficiency, control the waste material actively, save cost. We can made products as per the customer’s detail specification. Cleanroom Cloth: Made of 100%
Parts & Supplies | SMT Equipment
SMT Cleanroom wiper ,the details are as below: SMT stencil clean: Roll improve the working efficiency, control the waste material actively, save cost. We can made products as per the customer’s detail specification. Cleanroom Cloth: Made of 100%
Parts & Supplies | SMT Equipment
SMT Cleanroom wiper ,the details are as below: SMT stencil clean: Roll improve the working efficiency, control the waste material actively, save cost. We can made products as per the customer’s detail specification. Cleanroom Cloth: Made of 100%
Technical Library | 2015-06-04 19:10:47.0
Integrators and designers of high-reliability systems exert little or no control over component-level plating processes that affect the propensity for tin whiskering. Challenges of how to assure long-term reliability, while continuing to use COTS parts plated with pure tin, continue to arise. An integrated, quantitative, standardized methodology is proposed whereby mitigation levels can be selected that are appropriate for specific applications of pure tin for given end-uses. A system of hardware end-use classification is proposed, together with recommended appropriate risk mitigation approaches. An updated version of the application-specific risk assessment algorithm is presented together with recommended thresholds for acceptability within the context of the hardware classifications.
Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
Technical Library | 2012-08-02 21:05:14.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Pure tin is a common finish for copper hook up wire, coaxial cable, ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports o
Technical Library | 2012-08-16 22:38:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniqu
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Aerosol 1 gallon Pail 5 Gallon Pail 55 Gallon Drum A Triple-Threat Defluxer, Degreaser and Stencil Cleaner Strong, Versatile Cleaning Relatively Slow Drying for Economical Cleaning Generally Plastic-Safe Ultra-Pure Evaporates Completely, No Ri
