Technic Releases TechniPad 7611 New high-performance pure palladium for TechniPad ENEPIG offers a consistent deposit with less maintenance Cranston, RI, USA - Technic has announced the release of TechniPad 7611, an electroless process that deposit
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2018-09-06 15:18:14.0
Although many High Q capacitors are available on the market, performance can vary widely depending on design and quality of manufacturing
Technical Library | 2012-10-11 19:50:09.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper shows the benefits by using a pure palladium Layer in the ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) and ENEP (Electroless Nickel, Electroless P
Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers SMTnet Express October 11, 2012, Subscribers: 25550, Members: Companies: 9005, Users: 33789 Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Abstract 24-2 Copper Wire Bonding on Pure Palladium Surface Finishes - Eliminating The Gold Cost from The Electronic Package Mustafa Özkök, Hugh Roberts, and Horst Clauberg Abstract 24-2 Development of a Packaging System for Clinical Evaluation of a
