Torrey S. Crane manufactures a complete line of industrial solders ranging from pure tin and lead with alloys with silver,bismuth,antimony,and cadmium.Crane solders meet and exceed J-STD-006,QQS-571and ASTM B32 standards and are ISO 9002 CERTIFIED
Industry Directory | Manufacturer / Other
BGA Reballing Services - PBGA, TBGA, CBGA, and CSP reballing services as low as 0.02 cents/individual solder ball attachment. We provide solder column attachment, & tinning, by means of Hot Solder Dipping, for Electrical Components.
New Equipment | Solder Materials
KappaTinning Compound is a dry mixture of pure powdered Tin and flux specifically designed for pre-tinning cast Iron, Steel, Bronze and Copper bearing shells. A one pound container of KappaTinning Compound contains about twice as much Tin and goes fu
New Equipment | Assembly Services
Perfectly Controlled Immersion Tin System The Horizon Stannatech system is the leading immersion tin system within the entire PCB industry. Together with the Stannatech process and Atotech's unique Crystallizer and ConStannic control systems for im
Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef
See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti
Electronics Forum | Tue Feb 27 13:21:24 EST 2001 | kmorris
We've recently identified that one of our wavesolder machines has a high tin content. It should be 63% and is greater than 1% above that. We are adding pure tin to adjust the ratio back to 63%. I'm wondering what defects might be expected as the ti
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Industry News | 2008-04-08 23:29:59.0
Seoul, Korea � April 2008 � MIRTEC Co, LTD, the leading global manufacturer of AOI and AXI inspection systems announces it will showcase their complete line of inspection solutions in booth 4F10 at the upcoming NEPCON China/EMT China 2008 exhibition and conference, scheduled to take place April 8-11, 2008 in Shanghai, PR China.
Industry News | 2013-01-28 02:11:23.0
Offers precise, repeatable dispensing of phosphor for coating and encapsulation
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2012-08-16 22:38:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniqu
Quick Overview Solder dross separator SDS-10MS has Patent mixing and separation system which make separation more efficient and easier for operation, it is a best solution for small batch solder dross separation. To get more information from below
The EVS Solder Recovery system recylces solder form dross using no chemicals or additives, on site, in an efficient, easy process. As solder costs soar, manufacturers benefit from a quick ROI, reusing solder taken directly off their wave and processe
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
SMTnet Express, October 12, 2017, Subscribers: 30,913, Companies: 10,757, Users: 23,915 Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin David Pinsky, Tom Hester - Raytheon , Dr. Anduin Touw - The Boeing
SMTnet Express, June 4, 2015, Subscribers: 22,829, Members: Companies: 14,364 , Users: 38,296 Tin Whisker Risk Mitigation for High-Reliability Systems Integrators and Designers David Pinsky, Elizabeth Lambert; Raytheon Integrators and designers
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. Some candidates are described below. Pure Tin. Tin has good wettability/solderability over a large range of substrates, making it an excellent choice for lead finish through tin plating
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Schueller, Ph.D., W. Ables, and J. Fitch, Ph.D. Abstract 22-1 INVESTIGATION OF IMC GROWTH IN TIN SURFACE FINISH AND ITS EFFECT ON SOLDERABILITY IN FC-CSP PACKAGING HyunJung Lee, YeonSeop Yu, HyoJung Kim, Hee-Soo Kim Abstract 22-1 COMPREHENSIVE METHODOLOGY TO
