2015 Europlacer iiNeo Auction December 1, 2016 www.xlineassets.com
Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
Technical Library | 2017-12-21 11:24:05.0
The present work concerns on the use of sensors to monitor the structural health of wind turbine . Conventionally the inspection was made using non-contact sensing during the turbine’s inoperable period hence loss occurred. A real -time monitoring system via embedded wireless sensor is preferred but the sensor could only be implanted using non-contact printing method due to most turbine blade s’ curved surface. Conductive ink associate d with non-contact printing method via fluid dispensing system are proposed since conductive inks are proven stretchable and fluid dispensing system enables printing on various substrates and works well with any materials...
Used SMT Equipment | Soldering - Reflow
Heller 1810 MK III-IR IBE SMT Inventory ID : 160926-005 Heller Serial Number : 0910R2-B7A1S-85967-03 Vintage : OCT 2010 Hours : 21,813 Details • 3.5" Tunnel Clearance • IR Curing Oven • 20" Max Board Width • 4
Used SMT Equipment | Soldering - Reflow
New arrival, like new condition. Proto-type, small batch LPKF Zelflow R04 Solder Paste Reflow Oven. Very minimal use. Powered up and tested. 220 - 240VAC single phase. FOB: Origin ALSO AVAILABLE: LPKF ZELPRINT LT300 BENCH TOP SOLDER PASTE PRIN
Industry Directory | Consultant / Service Provider
KIC's provides products and services designed to improve a variety of thermal monitoring, profiling and process control applications.
Industry Directory | Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Media / Publisher / Online Resource
All Through-hole & SMT PC Board Assembly equipments,Reflow and wavesoldering equipments,Humiseal conformal coating,SCH Technologies conformal coating equipments,Kyzen Cleaning solutions,Metronelec Solderability tester,Curing oven
For heat dissipation Conventional methods measure an adhesive's bulk conductivity, in watts/m-°K. However, across a thin bondline, the resistance of the adhesive itself is only a fraction of the total resistance. Interfacial resistance is a signifi
For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring
Industry Directory | Manufacturer
Manufacturer of automated machinery for selective conformal coating, fluid dispensing, plasma treatment, assembly machines, and complete factory process line solutions.
