i-TECH ASYMTEK - Fluid Dispensing & Conformal Coating BTU - Reflow & Cure Oven Technology COGISCAN - Material/Component Tracking CYBEROPTICS - 3D Print Inspection, AOI Inspection ECMG - Printed Circuit Board Technologies
Used SMT Equipment | Soldering - Reflow
In a very good condition. It is actually drying and curing oven but you can easily use it, with a few modifications, as reflow oven. The ERSA HOTFLOW 2 line consists of various machine types all based on the same design. They are only set apart by t
Used SMT Equipment | Pick and Place/Feeders
EXCELLENT CONDITION (2011) FUJI NXT-II 4 BASE-8 MODULE SMT LINE Total Combined CPH: Over 200K Single Line LEFT to RIGHT flow Line Configuration: - Speedline MPM Momentum Screen Printer - PVA 650 Glue Dispenser - Fuji NXT II Mount
Industry News | 2019-01-17 14:34:10.0
Z-AXIS, Inc. (www.zaxis.net) has added equipment to expand and upgrade its capabilities for robotic conformal coating of SMT and mixed-technology printed circuit board assemblies (PCBAs) at its electronic design and contract electronic manufacturing services center near Rochester, NY.
UVLED is widely used in all walks of life is reasonable, UVLED has a great advantage over UV curing, its emergence is very necessary. Firstly, the service life of the UV curing system is longer than that of the traditional UV curing system of 800-30
Industry Directory | Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative / Training Provider
Largest Universal Instruments, Europlacer and Speedprint full service and stocking operation in the industry. Plus many other brands as we install complete turn key SMT lines new and used with full production launch and training.
Used SMT Equipment | Soldering - Reflow
Configuration: ● edge/mesh ● Dual Air cooling zones ● left to right transfer ● chain oilers ● SMEMA VERSATILE, DURABLE, HIGH-PERFORMANCE REFLOW AT A VERY COMPETITIVE PRICE The Bravo 8105 is a forced convection reflow oven with eight top an
Industry News | 2018-10-18 10:51:08.0
How Conformal Coating Protects PCBs
Industry Directory | Manufacturer
ROBOTHERM is an engineering and manufacturing company specialized in the field of semiconductor, smart cards, C.O.B (Chip on Board), C.O.F (Chip on Flex), S.M.T (Surface Mounted Technology) and hybrids applications.
Technical Library | 2020-07-29 19:58:48.0
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low cost LED lighting and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits. Aluminum is not easy to solder components to at low temperatures and PET cannot withstand high temperatures. Soldering to these materials requires either an additional surface treatment or the use of conductive epoxy to attach components. Surface treatment of aluminum includes the likes of Electroless Nickel Immersion Gold plating (ENIG), which is extensive wet-chemistry and cost-prohibitive for mass adoption. Conductive adhesives, including Anisotropic Conductive Paste (ACP), are another alternate to soldering components. These result in component substrate interfaces that are inferior to conventional solders in terms of performance and reliability. An advanced surface treatment technology will be presented that addresses all these constraints. Once applied on Aluminum surfaces using conventional printing techniques such as screen, stencil, etc., it is cured thermally in a convection oven at low temperatures. This surface treatment is non-conductive. To attach a component, a solder bump on the component or solder printed on the treated pad is needed before placing the component. The Aluminum circuit will pass through a reflow oven, as is commonly done in PCB manufacturing. This allows for the formation of a true metal to metal bond between the solder and the aluminum on the pads. This process paves the way for large scale, low cost manufacturing of Al-PET circuits. We will also discuss details of the process used to make functional aluminum circuits, study the resultant solder-aluminum bond, shear results and SEM/ EDS analysis.
