Super powerful expanding desiccant to keep boards & microelectronics moisture free.... Much different than Silica Sand Beads. Also supplier of corrosion prevention treatments that are alternatives to Conformal coatings.
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
Salvage indispensible Ball Grid Arrays. Artek Manufacturing will: *Clean and Bake out all contaminants and moisture *Clean out all exsisting Solder *Replace solder spheres according to manufacture's specs *Bake out BGA prior to packing in MSD package
New Equipment | Rework & Repair Equipment
Allgood Technology is equipped with a range of tools to rework and repair printed circuit assemblies to IPC-A-610 or your own company standards. Major Plant List: Metcal MFR-1351 Desoldering Station for through hole desoldering. Le
Electronics Forum | Fri Aug 10 07:33:32 EDT 2007 | davef
Tran Since we all agree that J-001 has no baking requirement, why are you baking the boards? What is the purpose of this bake process?
Electronics Forum | Wed Aug 08 17:26:40 EDT 2007 | htran
Hello All, I have been searching for the board assemblies bake out requirements acceptance criteria but unsuccessful. Does anyone knows if there are general guidelines for the percentage of the moisture absorption in the PWBs and PWAs? Thanks, Tran
Industry News | 2001-12-03 08:41:38.0
IPC will discuss the future of the industry at its PWB Presidents' Management Meeting. The meeting, entitled "Explore the Future of the PWB Industry," takes place in conjunction with IPC Printed Circuits Expo 2002.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Parts & Supplies | SMT Equipment
40046522 timing belt z JUKI2070 2080 40046514 IC T MOTOR BR 40046515 COUPRING 40046516 T PULLEY 40046517 FILTER MANIFOLD 40046519 FILTER BOX U 40046520 FILTER BOX L 40046521 TIMING BELT T 40046522 TIMING BELT Z 40046523 TIMING BELT Z IC 40
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JUKI 2070 2080 40046523 TIMING BELT Z IC 40046242 STK EMPTY LAMP 1 ASM 40046251 HOD LCD ASM 40046252 OPERATION LCD ASM 40046508 HMS AMP BR 40046509 DIFFUSER U 40046510 DIFFUSER L 40046511 DIFFUSER R 40046512 DIFFUSER V 40046513 IC Z SENSOR
Technical Library | 2018-09-21 10:12:53.0
Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.
Technical Library | 2022-09-12 14:07:47.0
Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyses coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMDs that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | , Ontario Canada | Maintenance
Title: Technologist � Mechanical SMT (Position based in London, Ontario) Basic Purpose of Position: To set-up, operate, calibrate, program, troubleshoot and adjust surface mount and through-hole technologies PWB assembly, soldering and cleaning equ
Career Center | Murphy, North Carolina USA | Engineering
We are seeking a qualified and experienced senior design engineer to join our team. The best candidate will use both mechanical and electrical engineering skills to design innovative power supplies that are highly efficient, rugged, and have high rel
Career Center | THRISSUR, India | Maintenance,Production
HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&
Career Center | , Minnesota USA | Engineering,Management,Production,Quality Control,Technical Support
Engineer with a diverse background in management, quality, computer and customer service. Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m
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Ceramic CCA's and Aqueous Wash and Bake Out Prior to Parylene Coating - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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