Full Site - : pwb baking (Page 3 of 7)

Pre-bake times and temperature for polyimide boards

Electronics Forum | Wed Jan 12 10:05:20 EST 2005 | Dreamsniper

we are using polyimide boards 6 inches x 7 inches, 2.5mm thick, 12 to 14 layers, for aerospace industries. I am using a long bake of 12 hours at 70'C prior to manufacturing or exposure to elevated reflow and wave soldering temperature. If schedule i

PWAs & PWB bake out requirements

Electronics Forum | Fri Aug 17 17:55:42 EDT 2007 | htran

My small reflow oven doesn't have the rails (only metal mesh). I personally don't think it was built for double side reflow assembly and there is vibration as well. We are a small low volume mfg house and our reflow oven doesn't have the capability t

PWAs & PWB bake out requirements

Electronics Forum | Sat Aug 18 08:40:34 EDT 2007 | davef

Here's how to double reflow your QFP: * Reflow the first side with the QFP according to plan. * Paste second side and place components according to plan. * Lightly crinkle a small, QFP-size piece of aluminum foil. [Note: the degree of crinklization

If we could bake the Board with OSP finish?

Electronics Forum | Thu Aug 05 16:15:18 EDT 2004 | pjc

Are you considering baking due to moisture exposure? Not all OSPs are created equal. I would check with your PWB fabricator about dry times and effects on their OSP finish. After you get it, I'd still try just one PWB for bake-dry out and check solde

Bare PWB bake out during circuit assembly

Electronics Forum | Fri Nov 05 14:47:35 EST 1999 | Russ Cutler

We recently came to a cross roads... We have historically baked out ALL of our circuit cards, with a 2 fold purpose 1) to dry the part marking ink, and 2) to eliminate any moisture, which could result in measling further in the process of assembly.

PWAs & PWB bake out requirements

Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef

There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si

Pb Drying / Degassing PWB

Electronics Forum | Fri Nov 21 09:29:11 EST 2008 | saintete1304

Hi , i desire to find the type of information : When the Soldering must be performed after baking for the PWB to not have a POP problem link to the moisture ? And the time for a flexible PWB ? thanks best regards

Re: Bare PWB bake out during circuit assembly

Electronics Forum | Fri Nov 05 21:22:34 EST 1999 | chartrain

Amazing in today's technology that people still bake because "that's the way we've alawys done it". Baking is a band aid for poor manufacturing of the PCB. Moisture can become trapped between the layers during buildup. This moisture when it contacts

PWAs & PWB bake out requirements

Electronics Forum | Thu Aug 16 13:00:32 EDT 2007 | russ

Here is what you need to do if you can, Since you want to shporten the bake time you need to increase temp. weigh a board prior to your current bake process (you need very hi resolution scale for this) weigh the same board after current process a

Re: Baking FR-4 PWB's prior to reflow

Electronics Forum | Tue Mar 21 20:37:51 EST 2000 | Dave F

Charlie: I�d plan never bake boards. Check the SMTnet Archives. Dave F


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