Full Site - : qfn and solder and void (Page 2 of 24)

SMTA Announces International Conference on Soldering and Reliability (ICSR) Program

Industry News | 2012-03-08 22:21:34.0

The SMTA is pleased to announce the program for the 2012 International Conference on Soldering and Reliability being held May 15-18 in Toronto, Ontario, Canada. Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto since 2007, this conference will bring together the community of soldering and reliability experts. The event will be co-located with the SMTA Lead-Free Academy and the SMTA Toronto Expo.

Surface Mount Technology Association (SMTA)

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2015-06-17 14:05:18.0

The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open. The conference will be held at the Donald Stephens Convention Center in Rosemont, Illinois on September 27 - October 1, 2015. This year's program allows the attendee to choose from 19 courses, 120 technical papers, three focused symposia, and numerous complimentary offerings throughout the conference and exhibition

Surface Mount Technology Association (SMTA)

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2011-06-24 19:39:13.0

The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open. The conference will be held at the Fort Worth Convention Center in Fort Worth, TX on October 16-20, 2011. This year's program allows the attendee to choose from 21 courses, 130 technical papers, 4 focused symposia, and numerous free offerings throughout the conference.

Surface Mount Technology Association (SMTA)

SMTA China Presents Seven Best Paper/Best Presentation Awards and Two Best Exhibit Awards at SMTA China East Conference 2017/NEPCON China 2017

Industry News | 2017-05-15 16:35:00.0

SMTA China announces that it presented awards for seven papers and two exhibits at the SMTA China East Conference 2017 Award Presentation Ceremony, held on Tuesday, April 25, 2017 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

Registration Open for IPC’s Conference on Solderability and Reliability for Electronics Assemblies in Budapest Industry experts to present on technical and business issues

Industry News | 2012-12-17 19:16:10.0

IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies.

Association Connecting Electronics Industries (IPC)

Cleaning, Military and Printed Electronics, Solderability and Reliability Highlight IPC APEX EXPO Technical Conference 35 technical sessions with nearly 100 research papers

Industry News | 2012-12-14 06:50:53.0

e IPC APEX EXPO® Technical Conference will cover two dozen technical topics in the areas of board fabrication, design and electronics assembly.

Association Connecting Electronics Industries (IPC)

Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated ‘F’ Revisions Cover More Advanced Technologies

Industry News | 2014-09-06 17:51:35.0

IPC — Association Connecting Electronics Industries® has released the F revisions of two of the industry’s most widely used standards, IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies.

Association Connecting Electronics Industries (IPC)

SMTA Capital Chapter’s Expo and Tech Forum to be Held on September 1st

Industry News | 2015-07-27 20:29:13.0

The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on September 1st. Exhibitors can save $100 by taking advantage of the early registration promotion available through July 31st. Contact Kaitlyn Gherity, SMTA Expo Manager, at 952-920-7682 or kaitlyn@smta.org to exhibit.

Surface Mount Technology Association (SMTA)

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)


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