Full Site - : qfn and solder and void (Page 12 of 24)

Nordson DAGE and Rockwell Collins Co-author Technical Paper on Voiding in Ball Grid Arrays

Industry News | 2011-09-23 22:09:26.0

Nordson DAGE announces that a Technical Paper entitled "The Last Will and Testament of the BGA Void" will be presented at the SMTA International Conference & Exhibition.

Nordson DAGE

How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:17:09.0

How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Global SMT & Packaging Recognizes Ersa for Rework and Repair at SMTAI

Industry News | 2016-09-28 10:37:39.0

Kurtz Ersa North America, announces that it was awarded a 2016 Global Technology Award in the category of Rework and Repair for its HR600/2 VOIDLESS. The award was presented to the company during a Tuesday, Sept. 27, 2016 ceremony that took place at the Donald Stephens Convention Center in Rosemont, IL during SMTA International. Ersa also was awarded in the Soldering – Selective category for the VERSAFLEX Ultra.

kurtz ersa Corporation

STI and Contributors to Present Results of 2 Research Papers At SMTA International Technical Conference

Industry News | 2019-08-04 20:09:21.0

STI Electronics announces two technical paper presentations in September at the SMTA International Technical Conference (SMTAI).

STI Electronics

MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Dallas and Houston Expo & Tech Forums

Industry News | 2011-02-17 14:59:07.0

MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming SMTA Dallas and Houston Expo & Tech Forums. The SMTA Dallas Expo & Tech Forum is scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX and the SMTA Houston Expo & Tech Forum is scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.

Finetech

MARTIN to Demonstrate Affordable Rework System and Mini-Oven Reball/PreBump Unit at SMTAI 2011

Industry News | 2011-09-19 16:30:56.0

MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system in Booth #407 at the upcoming SMTA International Conference & Exhibition.

MARTIN (a Finetech company)

New AT-GDP Series BGA Rework Station Provides the Latest Precision and Process Control

Industry News | 2009-09-23 21:53:53.0

Advanced Techniques US (ATCO)announces the development of an AT-GDP Series BGA Rework Station. Precise mechanics coupled with a comprehensive software package automates the device removal and installation processes. This model handles both leaded and lead-free applications consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s.

Advanced Techniques US Inc. (ATCO)

Christopher Associates Premiers Solder Pastes from Koki for ICT Performance and Fine-Pitch Printing

Industry News | 2009-12-14 20:45:09.0

December 2009 ? Christopher Associates, a pioneering supplier and distributor to the electronics and chemical processing industries, introduces two new solder pastes from Koki Company Ltd. (Tokyo, Japan).

Christopher Associates Inc.

Quadruple Industry Recognition for Nordson DAGE Test and Inspection systems at Nepcon China 2018

Industry News | 2018-05-02 20:22:07.0

Nordson DAGE announces that it was recognized with four awards for its Test and Inspection systems during Nepcon China, the prestigious global exhibition on SMT (surface mount technology) and EMA (electronics manufacturing automation) that brings together all major brands from the electronics manufacturing industry, held in Shanghai 24th – 26th April 2018.

Nordson DAGE

Soldering, Coating, Cleaning and PCB Process Failures from the Desk of Bob Willis

Industry News | 2018-03-25 13:21:16.0

The widest selection of online webinars in the industry has added more titles

ASKbobwillis.com


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