Localization of high-power lasers accelerates, and development bottlenecks need to be broken Superpower lasers are characterized by small size, light weight, high electro-optic conversion efficiency, stable performance, high reliability and lon
Technical Library | 2015-06-11 21:20:29.0
The use of bottom terminated components (BTC) has become widespread, specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type, improved electrical and thermal performance relative to older packaging technology, and low cost make the QFN/BTC attractive for many applications.Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements
Industry News | 2015-10-13 19:27:42.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void (
Industry News | 2015-10-15 12:35:31.0
Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solders, will lead a professional development course at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26, in Orlando, Fla. Jensen's course, Improving Mechanical, Electrical, and Thermal Reliability of Electronics, provides practical knowledge that can be applied to current processes to improve the overall reliability of electronics assemblies.
Industry News | 2015-10-18 20:03:37.0
Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solders, will lead a professional development course at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26, in Orlando, Fla.
Industry News | 2018-10-09 14:46:48.0
Kester will be exhibiting (booth #117) at SMTAI 2018, which will take place October 16-17 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2020-02-11 04:22:16.0
Providing process information and solving process defects is what I have been doing for many years with different organisations. In addition we have in the past created reports on 0201 assembly and testing of PCB surface finishes for lead-free assembly
Industry News | 2014-09-06 18:07:02.0
Metcal today announced that it will hold its next rework workshop in conjunction with Kester Solder.
Industry News | 2015-02-16 06:32:38.0
We offer the widest range of Photo CD-ROMs which provide process, quality engineers, marketing or editorial staff with a unique source of photographs which may be used in company inspection documents, technical presentations and websites
Industry News | 2014-04-08 09:39:42.0
Metcal today announced the venues for the next two stops on its 2014 rework tour.
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