Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Technical Library | 2010-03-23 11:50:22.0
This document discuss how to design SMT stencil base on IPC-7525. Introduction: PCBA (Printed Circuit Board Assembly) is a segment of printed circuit board technology. This segment of printed circuit board industry is concentrated in assemble all the pieces of electronic industry to one piece before output them to market. This segment covers: interconnection technology, package design technology, system integration technology, board and system test technology
Industry News | 2022-11-22 06:14:08.0
Full-auto SMT Stencil Printer is indispensable equipment in SMT production Line. It is generally composed of board mounting, solder paste, imprinting, and circuit board transfer. Widely used are Full-auto SMT Stencil Printer and semi-auto SMT Stencil Printer These two types, next, let's share with you the operating instructions of Full-auto SMT Stencil Printer.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
New Equipment | Tape and Reel Equipment
Compact designed machines to match perfectly different kind of modular operation process Key configuration : Tray in - Tray out Tray in - Tape out Tape in - Tape out Tube in - Tape out Tube in - Tube out Bowl input Bulk output Popular cus
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
Events Calendar | Wed Mar 08 00:00:00 EST 2017 - Wed Mar 08 00:00:00 EST 2017 | San Diego, California USA
San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components
New Equipment | Cleaning Equipment
QYSMT / MOREL Fully Automatic Stencil Cleaning System BMP-750 Features ▶All stainless steel body, beautiful, wear resistance, corrosion resistance, in line with environmental protection requirements and standards. ▶The fully pneumatic operation, n
New Equipment | Cleaning Equipment
I.C.T-750 SMT Pneumatic Stencil Cleaner Equipment Introduce: I.C.T-750 is a pneumatic stencil cleaning machine which used to clean SMT solder paste or red glue printing stencil. Famous pneumatic parts,strictly produce process,patented rotation sp
New Equipment | Cleaning Equipment
SMT Pneumatic Stencil Cleaning Machine Discover our high-performance SMT pneumatic stencil cleaning machine designed to efficiently clean and optimize stencils for flawless PCB printing. Improve production quality effortlessly with our advanced st
