This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems
This video shows the NEW PDR IR-D3i SMT / BGA Rework station in action! Using PDR's patented Focused IR technology, the D3i & D3Vi Discovery series Rework systems have been specifically designed to cope with the challenges of repairing today's PCB
Industry News | 2010-07-29 15:10:06.0
Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.
Industry News | 2019-11-05 22:24:42.0
Designing a PCB for automatic assembly and full production runs requires a few design changes from an initial prototype PCB run. Today most PCBs are assembled and tested with automated machines from the data from PCB drawing files. With up to 80% of a new product's cost determined by the first prototype build, avoiding late changes and designing with manufacturing in mind can have a significant impact on the product cost, reliability, and yield of a PCB design. Luckily, if some good choices are made early in the design process, designing a PCB for manufacturing is relatively straight forward with few pitfalls.
Industry News | 2008-12-15 15:28:33.0
LOS ALAMITOS, CA - December 2008 - With the wide acceptance of Amkor's FusionQuad� (VQFP/HVF-PQFP), Practical Components has added two new test boards to its lineup. FusionQuad� packages are leadframe-based plastic offering the effective integration of ExposedPad TQFP and MLF� technologies. FusionQuad� not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50 percent reduction in package size for a given leadcount.
Industry News | 2014-07-28 13:56:52.0
240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.
Industry News | 2007-11-27 12:01:32.0
FINETECH application packages offered for FINEPLACER� rework systems provide an easy way to enhance the machine�s scope of application. These packages include custom-tailored modules and tools to ensure perfect results for special rework applications.
Industry News | 2013-03-12 14:11:50.0
After successfully launching the first X3 In-line X-Ray system in 2011, MatriX Technologies now presented its new X3L system in the USA. As of this year, besides the universal 3D inspection system X3, the X3L configuration is available with an innovative dual detector concept, combining a line-scan for transmission inspection of complete PCBs in a few seconds and a high-resolution digital flatpanel detector for selective 3D image capturing.
Industry News | 2024-02-19 12:13:44.0
Indium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will present a technical paper on January 31 at IMAPS France – 17th European Advanced Technology Workshop on Micropackaging and Thermal Management in La Rochelle, France.
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
