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Indium Corporation Expert to Present at Electronic Components and Technology Conference

Industry News | 2022-04-28 14:33:02.0

Indium Corporation® Principal Engineer and Manager for Thermal Interface Materials Applications Andy Mackie, Ph.D., MSc, will share his technical expertise and insight on solder thermal interface material (TIM) processes at Electronic Components and Technology Conference (ECTC) taking place May 31-June 3, in San Diego, Calif., U.S.

Indium Corporation

Practical Components Announces PCB200-Thermal Cycle Availability

Industry News | 2010-07-16 16:08:56.0

Practical Components, a leading international distributor of mechanical IC samples or “dummy” components and SMD production tools and equipment, announces in-stock availability of the popular 15 mm PoP Thermal Cycling Board.

Practical Components, Inc.

Nihon Superior to Introduce Ultra Low Voiding Solder Paste at SMTA International 2012

Industry News | 2012-09-12 17:00:31.0

Nihon Superior Co. Ltdwill introduce newly developed solder paste for low voiding in soldering processes and materials

Nihon Superior Co., Ltd.

MacDermid Alpha Introduces Ultra-Fine Feature Solder Paste at Productronica China in Shanghai

Industry News | 2021-03-06 03:21:15.0

The Assembly Solutions division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will introduce ALPHA® OM-372 its latest ultra-fine feature solder paste innovation at Productronica China at the Shanghai New International Expo Centre in Shanghai, China from March 17-19.

MacDermid Alpha Electronics Solutions

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Industry News | 2018-10-18 08:59:34.0

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Flason Electronic Co.,limited

Indium Corporation Expert to Present at SiP Conference China

Industry News | 2021-08-28 04:15:29.0

Shrinking stencil apertures and gaps between padshave necessitated more critical solder paste printing requirements. Indium Corporation expert Leo Hu, senior area technical manager, will cover these conditions and more when he presents on finefeature solder paste printing for heterogeneous integration assembly at SiP Conference China, Sept. 27-29, Shenzhen, China.

Indium Corporation

Indium Corporation Announces SMTA South China Presentations

Industry News | 2021-08-13 08:33:52.0

Five Indium Corporation experts will participate in the SMTA South China Conference, Aug. 25-27, Shenzhen, China. This event is held in conjunction with NEPCON Asia 2021 at the Shenzhen Convention & Exhibition Center.

Indium Corporation

Surface-mount technology

Industry News | 2018-10-18 09:15:23.0

Surface-mount technology

Flason Electronic Co.,limited

Practical Components to Debut Advanced Technologies at IWLPC

Industry News | 2019-09-25 16:15:46.0

Practical Components announces that it will exhibit in booth 31 at the 2019 International Wafer-Level Packaging Conference (IWLPC) from October 22-23, 2019 at DoubleTree by Hilton in San Jose, CA. Practical Components has added many new Test Wafers for miniaturized Surface Mount Technology (SMT) to its array of Dummy Components, Solder Training Kits and PCB Evaluation Kits.

Practical Components, Inc.

Indium Corporation Expert to Present at iNEMI Seminar Hosted by Zestron Europe

Industry News | 2024-01-29 11:14:41.0

Indium Corporation Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will present at iNEMI's upcoming seminar, Humidity Robustness and Isolation Coordination for e-Mobility. The seminar, hosted by ZESTRON Europe, will be held on February 1 in Ingolstadt, Germany.

Indium Corporation


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